生命周期: | Contact Manufacturer | 零件包装代码: | WAFER |
包装说明: | DIE, | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.63 |
JESD-30 代码: | R-XUUC-N | JESD-609代码: | e4 |
内存密度: | 2048 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 8 | 功能数量: | 1 |
字数: | 256 words | 字数代码: | 256 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -20 °C | 组织: | 256X8 |
封装主体材料: | UNSPECIFIED | 封装代码: | DIE |
封装形状: | RECTANGULAR | 封装形式: | UNCASED CHIP |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | GOLD |
端子形式: | NO LEAD | 端子位置: | UPPER |
Base Number Matches: | 1 |
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