thru
M 10F
M 05
B F
B
Miniature Glass Passivated Single-Phase Surface Mount Flat Bridge Rectifier
VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES
Major Ratings and Characteristics
IF(AV)
VRRM
IFSM
0.5A , 0.8A
50-1000V
35 A
IR
VF
5.0 μA
1.0V
Tj max.
150 °C
FEATURES
●
●
●
●
●
●
●
Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering:
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
●
MECHANICAL DATA
●
●
●
Case: MBF Molded plastic
over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Polarity symbols marked on body
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
(TA = 25 °C unless otherwise noted)
Symbol MB05FMB1FMB2FMB4FMB6FMB8FMB10F UNIT
VRRM
VRMS
VDC
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50 100 200 400 600 800 1000
35 70 140 280 420 560 700
V
V
V
Maximum DC blocking voltage
50 100 200 400 600 800 1000
Maximum average forward output rectified
IF(AV)
0.5
0.8
A
current at TA=30℃
-on glass-epoxy P.C.B(NOTE 1)
-on aluminum substrate(NOTE 2)
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
Maximum instantaneous forwad voltage drop
per leg at 0.4A
IFSM
VF
IR
35
1
A
V
TA = 25 ℃
TA = 125℃
Maximum DC reverse current at
rated DC blocking voltage per leg
5.0
100
μA
CJ
RθJA
RθJA
Typical junction capacitance per leg at 4.0 V ,1MHz
(NOTE 1)
13
p F
85
70
20
℃/ W
Thermal resistance per leg
(NOTE 2)
(NOTE 1)
RθJL
TJ, TSTG
Operating junction and storage temperature range
–55 to +150
℃
NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads
NOTE2:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20×20mm) mounted
on 0.05×0.05″(1.3×1.3mm) solder pad
www.paceleader.tw
1