Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier
VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES
thru
M 10F
B
M 05
B F
μ
FEATURES
MBF
●
●
●
●
●
●
●
Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering:
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
●
MECHANICAL DATA
●
●
●
Case: MBF Molded plastic
over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Polarity symbols marked on body
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
(TA = 25 C unless otherwise noted)
°
Symbol MB05FMB1FMB2FMB4FMB6FMB8FMB10F UNIT
VRRM
VRMS
VDC
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50 100 200 400 600 800 1000
35 70 140 280 420 560 700
V
V
V
Maximum DC blocking voltage
50 100 200 400 600 800 1000
Maximum average forward output rectified
IF(AV)
0.5
0.8
A
current at TA=30℃
-on glass-epoxy P.C.B(NOTE 1)
-on aluminum substrate(NOTE 2)
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
Maximum instantaneous forwad voltage drop
per leg at 0.4A
IFSM
VF
IR
35
1
A
V
TA = 25 ℃
TA = 125℃
Maximum DC reverse current at
rated DC blocking voltage per leg
5.0
100
μA
CJ
RθJA
RθJA
Typical junction capacitance per leg at 4.0 V ,1MHz
(NOTE 1)
13
p F
85
70
20
℃/ W
Thermal resistance per leg
(NOTE 2)
(NOTE 1)
RθJL
TJ, TSTG
Operating junction and storage temperature range
–55 to +150
℃
NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads
NOTE2:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20×20mm) mounted
on 0.05×0.05″(1.3×1.3mm) solder pad
Web Site:
WWW.PS-PFS.COM