是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | HVQCCN, LCC32,.2SQ,20 | 针数: | 32 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.66 |
信道分离: | 75 dB | 商用集成电路类型: | VOLUME CONTROL CIRCUIT |
JESD-30 代码: | S-XQCC-N32 | JESD-609代码: | e3 |
长度: | 5 mm | 湿度敏感等级: | 1 |
信道数量: | 2 | 功能数量: | 1 |
端子数量: | 32 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装等效代码: | LCC32,.2SQ,20 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
子类别: | Audio/Video Amplifiers | 最大压摆率: | 18 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.7 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX9775ETJ+* | MAXIM |
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2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier | |
MAX9776 | MAXIM |
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2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier | |
MAX9776EBX+T | MAXIM |
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2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier | |
MAX9776EBX+TG45 | MAXIM |
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Volume Control Circuit | |
MAX9776ETJ+ | MAXIM |
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2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier | |
MAX9776ETJ+T | MAXIM |
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Volume Control Circuit, 1 Channel(s), BICMOS, 5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO | |
MAX9776EVKIT | MAXIM |
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Highly Programmable Input and Output Modes | |
MAX9776EVKIT+ | MAXIM |
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Highly Programmable Input and Output Modes | |
MAX9777 | MAXIM |
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Stereo 3W Audio Power Amplifiers with Headphone Drive and Input Mux | |
MAX9777ETI+ | MAXIM |
获取价格 |
Stereo 3W Audio Power Amplifiers with Headphone Drive and Input Mux |