是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | LSSOP, TSOP6,.11,37 | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 0.78 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G6 | JESD-609代码: | e3 |
长度: | 2.9 mm | 湿度敏感等级: | 1 |
信道数量: | 4 | 功能数量: | 1 |
端子数量: | 6 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LSSOP | 封装等效代码: | TSOP6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1/5.5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.45 mm |
子类别: | Power Management Circuits | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.625 mm | Base Number Matches: | 1 |
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