是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 1 X 1.50 X 0.30 MM, UCSP-6/5 | 针数: | 6/5 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.36 |
模拟集成电路 - 其他类型: | THREE TERMINAL VOLTAGE REFERENCE | JESD-30 代码: | R-PBGA-B5 |
JESD-609代码: | e0 | 长度: | 1.52 mm |
功能数量: | 1 | 输出次数: | 1 |
端子数量: | 5 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电压: | 5.01 V |
最小输出电压: | 4.99 V | 标称输出电压: | 5 V |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 0.67 mm | 最大供电电压 (Vsup): | 12.6 V |
最小供电电压 (Vsup): | 5.2 V | 标称供电电压 (Vsup): | 5.5 V |
表面贴装: | YES | 最大电压温度系数: | 30 ppm/ °C |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
微调/可调输出: | NO | 宽度: | 1 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX6023EBT | MAXIM |
获取价格 |
CHIP SCALE DEVICES | |
MAX6023EBT12-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6023EBT21 | MAXIM |
获取价格 |
Voltage Reference, 2.048V, PBGA6 | |
MAX6023EBT21+T | MAXIM |
获取价格 |
Three Terminal Voltage Reference, 1 Output, 2.048V, PBGA5, UCSP-5 | |
MAX6023EBT21-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6023EBT25 | MAXIM |
获取价格 |
Voltage Reference, 2.5V, PBGA6 | |
MAX6023EBT25+ | MAXIM |
获取价格 |
Three Terminal Voltage Reference, | |
MAX6023EBT25+T | MAXIM |
获取价格 |
Three Terminal Voltage Reference, 1 Output, 2.5V, PBGA5, UCSP-5 | |
MAX6023EBT25-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6023EBT30+ | MAXIM |
获取价格 |
Three Terminal Voltage Reference, |