是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | UCSP-5 | 针数: | 5 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 1.48 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | THREE TERMINAL VOLTAGE REFERENCE | JESD-30 代码: | R-PBGA-B5 |
JESD-609代码: | e3 | 长度: | 1.52 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
输出次数: | 1 | 端子数量: | 5 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
最大输出电压: | 3.006 V | 最小输出电压: | 2.994 V |
标称输出电压: | 3 V | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA6,2X3,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.67 mm | 子类别: | Voltage References |
最大供电电压 (Vsup): | 12.6 V | 最小供电电压 (Vsup): | 3.2 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
最大电压温度系数: | 30 ppm/ °C | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 微调/可调输出: | NO |
最大电压容差: | 0.2% | 宽度: | 1 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX6023EBT30-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6023EBT41-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6023EBT45+T | MAXIM |
获取价格 |
Three Terminal Voltage Reference, 1 Output, 4.5V, PBGA5, UCSP-5 | |
MAX6023EBT45-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6023EBT50+ | MAXIM |
获取价格 |
Three Terminal Voltage Reference, | |
MAX6023EBT50+T | MAXIM |
获取价格 |
Three Terminal Voltage Reference, 1 Output, 5V, PBGA5, UCSP-5 | |
MAX6023EBT50-T | MAXIM |
获取价格 |
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference | |
MAX6025 | MAXIM |
获取价格 |
+5V.Serial-Input.Voltage-Output 16-Bit DACs[MAX541/MAX542/MAX541/MAX542/MAX541/MAX542/MAX5 | |
MAX6025 | ADI |
获取价格 |
高精度、低功耗、低压差、SOT23-3封装、电压基准 | |
MAX6025A | ADI |
获取价格 |
高精度、低功耗、低压差、SOT23-3封装、电压基准 |