是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 1.50 X 1.02 MM, 0.50 MM PITCH, BUMP, UCSP-6 | 针数: | 6 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.65 | 模拟集成电路 - 其他类型: | SPST |
JESD-30 代码: | R-PBGA-B6 | JESD-609代码: | e0 |
长度: | 1.98 mm | 湿度敏感等级: | 1 |
正常位置: | NO | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 6 |
标称断态隔离度: | 90 dB | 最大通态电阻 (Ron): | 2.5 Ω |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA6,2X3,20 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 240 |
电源: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 0.67 mm | 子类别: | Multiplexer or Switches |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
最长断开时间: | 12 ns | 最长接通时间: | 30 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn63Pb37) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 1.75 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX4686EBT-T | MAXIM |
获取价格 |
2.5?, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | |
MAX4687 | MAXIM |
获取价格 |
2.5?, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | |
MAX4687EBT | MAXIM |
获取价格 |
SPST, 1 Func, 1 Channel, CMOS, PBGA6, 1.50 X 1.02 MM, 0.50 MM PITCH, BUMP, UCSP-6 | |
MAX4687EBT-T | MAXIM |
获取价格 |
2.5?, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | |
MAX4688 | MAXIM |
获取价格 |
2.5?, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | |
MAX4688 | ADI |
获取价格 |
2.5Ω、低电压、SPST/SPDT模拟开关,UCSP封装 | |
MAX4688EBT+ | MAXIM |
获取价格 |
SPDT, 1 Func, 1 Channel, PBGA6, 1.50 X 1.02 MM, 0.50 MM PITCH, BUMP, UCSP-6 | |
MAX4688EBT+T | MAXIM |
获取价格 |
SPDT, 1 Func, 1 Channel, PBGA6, 0.5 MM PITCH, MICRO, CSP-6 | |
MAX4688EBT-T | MAXIM |
获取价格 |
2.5?, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | |
MAX468C/D | MAXIM |
获取价格 |
Two-Channel, Triple/Quad RGB Video Switches and Buffers |