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MAX3825U

更新时间： 2024-11-13 11:17:23
品牌 Logo 应用领域
美信 - MAXIM 放大器
页数 文件大小 规格书
8页 616K
描述
+3.3V, 2.5Gbps Quad Transimpedance Amplifier for System Interconnects

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MAX3825U 数据手册

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19-1855 Rev 0; 11/00  
+3.3V, 2.5Gbps Quad Transimpedance Amplifier  
for System Interconnects  
General Description  
Features  
The MAX3825 is a quad transimpedance amplifier (TIA)  
intended for 2.5Gbps system interconnect applications.  
Each of the four channels converts a small photodiode  
current to a measurable differential voltage with a tran-  
simpedance gain of 3.7kΩ. The circuit features  
o Single +3.3V Supply  
o 93mW per Channel Power Dissipation  
o 460nA Input-Referred Noise  
RMS  
o 20ps Deterministic Jitter  
460nA  
of input-referred noise per channel corre-  
RMS  
o 2.4GHz Small-Signal Bandwidth  
o No External Compensation  
sponding to an optical input sensitivity of -22.3dBm  
(BER ≤ 1 × 10-14). The quad transimpedance amplifier  
has 20ps of deterministic jitter and a 2.4GHz small-sig-  
nal bandwidth. The MAX3825 is optimized for use with  
a quad PIN photodetector array with a standard fiber  
pitch of 250µm.  
o 40dB Power-Supply Rejection Ratio  
o Compact Die with 250µm Channel Pitch  
o 100Ω Differential Output Impedance  
The MAX3825 operates from a single +3.3V supply  
over a 0°C to +85°C temperature range. With a +3.3V  
supply, each channel dissipates 93mW of power. A DC  
cancellation circuit on each channel provides a true dif-  
ferential output swing over a wide range of input cur-  
rents.  
Ordering Information  
PART  
TEMP. RANGE  
PIN-PACKAGE  
MAX3825U/D  
0°C to +85°C  
Dice*  
*Dice are designed to operate with a 0°C to +120°C junction  
temperature, but are tested and guaranteed only at T = +25°C.  
A
Each channel has an independent supply and ground  
to allow all or any combination of channels to be con-  
nected. This device is available in dice only.  
Applications  
ATM Switching  
Networks  
High-Speed Parallel  
Optical Links  
System Interconnects  
SDH/SONET  
Backplanes  
Typical Operating Circuit appears at end of data sheet.  
Dense Digital Cross-  
Connects  
Chip Topography/Pad Configuration  
V
V
V
V
V
OUT3+ OUT3- V  
V
OUT4+ OUT4-V  
OUT1-  
34  
OUT2+ OUT2-  
CCO3  
CCO1 OUT1+  
CCO1 CCO2  
CCO2  
CCO3 CCO4  
CCO4  
N.C.  
36  
35  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24 23 22  
21  
20  
GNDO4  
GNDO1  
37  
19  
18  
GNDO3  
ENABLE  
GNDO2  
GNDF  
38  
39  
17  
16  
GNDI3  
VCCI3  
GNDI2  
VCCI2  
40  
41  
15  
14  
VCCI4  
GNDI4  
VCCI1  
GNDI1  
42  
43  
V
44  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
CCFILT  
N.C. N.C. FILTER  
IN1 FILT1 IN2 FILT2 IN3 FILT3 IN4 FILT4  
N.C. N.C.  
________________________________________________________________ Maxim Integrated Products  
1
For price, delivery, and to place orders, please contact Maxim Distribution at 1-888-629-4642,  
or visit Maxim’s website at www.maxim-ic.com.  
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