是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | QFN | 包装说明: | 4 X 4 MM, 0.80 MM HEIGHT, MO-220, TQFN-24 |
针数: | 24 | Reach Compliance Code: | unknown |
风险等级: | 5.6 | Is Samacsys: | N |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | S-XQCC-N24 |
JESD-609代码: | e0 | 长度: | 4 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 24 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 245 |
认证状态: | COMMERCIAL | 座面最大高度: | 0.8 mm |
最大供电电压: | 5.5 V | 最小供电电压: | 3.14 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4 mm | Base Number Matches: | 1 |
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