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MAX3394E PDF预览

MAX3394E

更新时间: 2024-11-15 14:57:59
品牌 Logo 应用领域
亚德诺 - ADI 驱动转换器电平转换器
页数 文件大小 规格书
21页 1746K
描述
±15kV ESD保护、大电流驱动、双/四/八通道电平转换器,带有加速电路

MAX3394E 数据手册

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MAX3394E/MAX3395E/  
MAX3396E  
±15kV ESD-Protected, High-Drive Current,  
Dual-/Quad-/Octal-Level Translators with  
Speed-Up Circuitry  
General Description  
Features  
±15kV ESD Protection on I/O V  
Lines  
The MAX3394E/MAX3395E/MAX3396E bidirectional level  
translators provide level shifting required for data transfer  
in a multivoltage system. Internal slew-rate enhancement  
circuitry features 10mA current-sink and 15mA current-  
source drivers to isolate capacitive loads from lower current  
drivers. In open-drain systems, slew-rate enhancement  
enables fast data rates with larger pullup resistors and  
increased bus load capacitance. Externally applied volt-  
CC_  
Bidirectional Level Translation Without Direction Pin  
I/O V and I/O V 10mA Sink-/15mA Source-  
L_  
CC_  
Current Capability  
Slew-Rate Enhancement Circuitry Supports  
Larger Capacitive Loads or Larger External Pullup  
Resistors  
6Mbps Push-Pull/1Mbps Open-Drain Guaranteed  
ages, V  
and V , set the logic-high levels for the device.  
CC  
L
Data Rate  
A logic-low signal on one I/O side of the device appears as  
a logic-low signal on the opposite I/O side, and vice-versa.  
Wide Supply-Voltage Range: Operation Down to  
Each I/O line is pulled up to V  
resistor, allowing the devices to be driven by either push-  
pull or open-drain drivers.  
or V by an internal pullup  
+1.2V on V and +1.65V on V  
Low Supply Current in Tri-State Output Mode  
CC  
L
L CC  
(3μA typ)  
The MAX3394E/MAX3395E/MAX3396E feature a tri-  
state output mode, thermal-shutdown protection, and  
±15kV Human Body Model (HBM) ESD protection on the  
Low Quiescent Current  
Thermal-Shutdown Protection  
UCSP, TDFN, and TQFN Packages  
V
side for greater protection in applications that route  
CC  
signals externally.  
Ordering Information  
The MAX3394E/MAX3395E/MAX3396E accept V  
volt-  
CC  
PART  
PIN-PACKAGE  
8 TDFN-EP**  
9 UCSP  
PKG CODE  
T833-1  
B9-5  
ages from +1.65V to +5.5V, and V voltages from +1.2V  
L
MAX3394EETA+T  
MAX3394EEBL+T  
MAX3395EETC+  
MAX3395EEBC+T  
MAX3396EEBP+T*  
MAX3396EETP+*  
to V , making them ideal for data transfer between low  
CC  
voltage ASIC/PLDs and higher voltage systems. The  
MAX3394E/MAX3395E/MAX3396E operate at a guaran-  
teed data rate of 6Mbps with push-pull drivers and 1Mbps  
with open-drain drivers.  
12 TQFN-EP**  
12 UCSP  
T1244-4  
B12-1  
20 UCSP  
B20-1  
The MAX3394E is a dual-level translator available in  
9-bump UCSP™ and 8-pin 3mm x 3mm TDFN packages.  
The MAX3395E is a quad-level translator available in  
12-bump UCSP, and 12-pin 4mm x 4mm TQFN packag-  
es. The MAX3396E is an octal-level translator available in  
20-bump UCSP and 20-pin 5mm x 5mm TQFN packages.  
The MAX3394E/MAX3395E/MAX3396E operate over the  
extended -40°C to +85°C temperature range.  
20 TQFN-EP**  
T2055-4  
Note: All devices specified over the -40°C to +85°C operating  
range.  
+Denotes lead(Pb)-free/RoHS-compliant package.  
*Future product—contact factory for availability.  
**EP = Exposed paddle.  
Selector Guide appears at end of data sheet.  
Pin Configurations  
Applications  
Multivoltage Bidirectional Level Translation  
SPI™, MICROWIRE™, and I C Level Translation  
Open-Drain Rise-Time Speed-Up  
High-Speed Bus Fan-Out Expansion  
Cell Phones  
TOP VIEW  
(LEADS ON BOTTOM)  
2
8
6
7
5
*EP  
MAX3394E  
Telecom, Networking, Servers, RAID/SAN  
+
1
2
3
4
MICROWIRE is a trademark of National Semiconductor Corp.  
SPI is a trademark of Motorola, Inc.  
UCSP is a trademark of Maxim Integrated Products, Inc.  
TDFN  
*CONNECT EXPOSED PAD TO GROUND  
Pin Configurations continued at end of data sheet.  
19-3884; Rev 3; 7/17  

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