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MAX2358ETI-T PDF预览

MAX2358ETI-T

更新时间: 2024-11-06 13:10:27
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
8页 108K
描述
RF and Baseband Circuit, BICMOS, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28

MAX2358ETI-T 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:QFN包装说明:5 X 5 MM, 0.80 MM HEIGHT, TQFN-28
针数:28Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01风险等级:5.75
Is Samacsys:NJESD-30 代码:S-XQCC-N28
JESD-609代码:e0长度:5 mm
湿度敏感等级:1功能数量:1
端子数量:28最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):240
认证状态:Not Qualified座面最大高度:0.9 mm
标称供电电压:2.75 V表面贴装:YES
技术:BICMOS电信集成电路类型:RF AND BASEBAND CIRCUIT
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:20
宽度:5 mmBase Number Matches:1

MAX2358ETI-T 数据手册

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MAX2531EGI  
Rev. A  
RELIABILITY REPORT  
FOR  
MAX2531EGI  
PLASTIC ENCAPSULATED DEVICES  
April 3, 2003  
MAXIM INTEGRATED PRODUCTS  
120 SAN GABRIEL DR.  
SUNNYVALE, CA 94086  
Written by  
Reviewed by  
Jim Pedicord  
Quality Assurance  
Reliability Lab Manager  
Bryan J. Preeshl  
Quality Assurance  
Executive Director  

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