MAX20336/MAX20337
Ultra-Small, Low-R , Beyond-the-Rails
ON
DPST/SPDT Analog Switches
Absolute Maximum Ratings
V
, CB to GND .................................................. -0.3V to +6V
FC2QFN (derate 5.83mW/°C above +70°C)..................466.2mW
Operating Temperature Range.............................-40°C to +85°C
Junction Temperature.......................................................+150°C
Storage Temperature Range ..............................-65°C to +150°C
Soldering Temperature (reflow) ........................................+260°C
CCEN
NO_, COM_, NC to GND............................................. -6V to +6V
Continuous Current NO_, COM_, NC ............................. ±500mA
Peak Current NO_, COM_, NC
(50% duty cycle, 10ms pulse)...................................... ±850mA
Continuous Power Dissipation (T = +70°C)
A
WLP (derate 10.51mW/°C above +70°C) ..................840.8mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Package Information
6 BUMP WLP (MAX20336)
Package Code
N60K1+1
Outline Number
21-100308
Land Pattern Number
Refer to Application Note 1891
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
)
95.15°C/W
JA
6 BUMP WLP (MAX20337)
Package Code
N60K1+2
Outline Number
21-100311
Land Pattern Number
Refer to Application Note 1891
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
)
95.15°C/W
JA
6 FC2QFN (MAX20336/MAX20337)
Package Code
F61A1F+1
Outline Number
21-100313
90-100167
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
Junction to Ambient (θ
)
171.6 ºC/W
58.7 ºC/W
JA
)
JC
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/
thermal-tutorial.
www.maximintegrated.com
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