Datasheet > MAX20337

MAX20337

更新时间： 2023-12-20 18:44:16

品牌	Logo	应用领域
亚德诺 - ADI		开关
页数	文件大小	规格书
16页	515K
描述
超小尺寸、低RON、超摆幅、DPST模拟开关

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数据手册

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MAX20337 数据手册

MAX20336/MAX20337

Ultra-Small, Low-R , Beyond-the-Rails

DPST/SPDT Analog Switches

Absolute Maximum Ratings

, CB to GND .................................................. -0.3V to +6V

FC2QFN (derate 5.83mW/°C above +70°C)..................466.2mW

Operating Temperature Range.............................-40°C to +85°C

Junction Temperature.......................................................+150°C

Storage Temperature Range ..............................-65°C to +150°C

Soldering Temperature (reflow) ........................................+260°C

CCEN

NO_, COM_, NC to GND............................................. -6V to +6V

Continuous Current NO_, COM_, NC ............................. ±500mA

Peak Current NO_, COM_, NC

(50% duty cycle, 10ms pulse)...................................... ±850mA

Continuous Power Dissipation (T = +70°C)

WLP (derate 10.51mW/°C above +70°C) ..................840.8mW

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

6 BUMP WLP (MAX20336)

Package Code

N60K1+1

Outline Number

21-100308

Land Pattern Number

Refer to Application Note 1891

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θ

)

95.15°C/W

6 BUMP WLP (MAX20337)

Package Code

N60K1+2

Outline Number

21-100311

Land Pattern Number

Refer to Application Note 1891

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θ

)

95.15°C/W

6 FC2QFN (MAX20336/MAX20337)

Package Code

F61A1F+1

Outline Number

21-100313

90-100167

Land Pattern Number

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θ

)

171.6 ºC/W

58.7 ºC/W

)

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/

thermal-tutorial.

www.maximintegrated.com

Maxim Integrated | 2

123 4 5 6 7...16

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