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MAX20337 PDF预览

MAX20337

更新时间: 2024-10-29 14:57:23
品牌 Logo 应用领域
亚德诺 - ADI 开关
页数 文件大小 规格书
16页 515K
描述
超小尺寸、低RON、超摆幅、DPST模拟开关

MAX20337 数据手册

 浏览型号MAX20337的Datasheet PDF文件第1页浏览型号MAX20337的Datasheet PDF文件第3页浏览型号MAX20337的Datasheet PDF文件第4页浏览型号MAX20337的Datasheet PDF文件第5页浏览型号MAX20337的Datasheet PDF文件第6页浏览型号MAX20337的Datasheet PDF文件第7页 
MAX20336/MAX20337  
Ultra-Small, Low-R , Beyond-the-Rails  
ON  
DPST/SPDT Analog Switches  
Absolute Maximum Ratings  
V
, CB to GND .................................................. -0.3V to +6V  
FC2QFN (derate 5.83mW/°C above +70°C)..................466.2mW  
Operating Temperature Range.............................-40°C to +85°C  
Junction Temperature.......................................................+150°C  
Storage Temperature Range ..............................-65°C to +150°C  
Soldering Temperature (reflow) ........................................+260°C  
CCEN  
NO_, COM_, NC to GND............................................. -6V to +6V  
Continuous Current NO_, COM_, NC ............................. ±500mA  
Peak Current NO_, COM_, NC  
(50% duty cycle, 10ms pulse)...................................... ±850mA  
Continuous Power Dissipation (T = +70°C)  
A
WLP (derate 10.51mW/°C above +70°C) ..................840.8mW  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the  
device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
Package Information  
6 BUMP WLP (MAX20336)  
Package Code  
N60K1+1  
Outline Number  
21-100308  
Land Pattern Number  
Refer to Application Note 1891  
THERMAL RESISTANCE, FOUR-LAYER BOARD  
Junction to Ambient (θ  
)
95.15°C/W  
JA  
6 BUMP WLP (MAX20337)  
Package Code  
N60K1+2  
Outline Number  
21-100311  
Land Pattern Number  
Refer to Application Note 1891  
THERMAL RESISTANCE, FOUR-LAYER BOARD  
Junction to Ambient (θ  
)
95.15°C/W  
JA  
6 FC2QFN (MAX20336/MAX20337)  
Package Code  
F61A1F+1  
Outline Number  
21-100313  
90-100167  
Land Pattern Number  
THERMAL RESISTANCE, FOUR-LAYER BOARD  
Junction to Ambient (θ  
Junction to Ambient (θ  
)
171.6 ºC/W  
58.7 ºC/W  
JA  
)
JC  
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.  
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different  
suffix character, but the drawing pertains to the package regardless of RoHS status.  
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a  
four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/  
thermal-tutorial.  
www.maximintegrated.com  
Maxim Integrated | 2  

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