是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | HVQCCN, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 2.13 | 其他特性: | IT ALSO REQUIRES 3.3 V |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-XQCC-N32 |
长度: | 5 mm | 功能数量: | 1 |
端子数量: | 32 | 最高工作温度: | 105 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 0.8 mm | 最大供电电压 (Vsup): | 5.25 V |
最小供电电压 (Vsup): | 4.75 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 5 mm |
Base Number Matches: | 1 |
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