Silicon SPDT HMIC™ PIN Diode Switch
50 MHz - 20 GHz
MASW-002103
Rev. V12
Functional Schematic
Features
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Broad Bandwidth Specified 50 MHz - 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance & Inductance
Silicon Nitride Passivation
Fully Monolithic, Glass Encapsulated Chip
Up to 38 dBm CW Power Handling @ +25°C
RoHS* Compliant
J3
J1
Applications
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Aerospace & Defense
ISM
J2
Description
Pin Configuration
The MASW-002103-1363 is a SPDT, surmount,
broadband, monolithic switch using two sets of
series and shunt connected PIN diodes. This device
is designed for use in broadband, low to moderate
signal, high performance, switch applications up to
20 GHz. It is a surface mountable switch configured
for optimized performance and offers a distinct
advantage over MMIC, beamlead and chip and wire
hybrid designs. Because the PIN diodes of the
MASW-002103-1363 are integrated into the chip
and kept within close proximity, the parasitics
typically associated with other designs that use
individual components are kept to a minimum.
Pin
J1
Function
RFC
J2
RF1
J3
RF2
Ordering Information
To minimize the parasitics and achieve high
performance the MASW-002103-1363 is fabricated
using MACOM’s HMIC™ (Heterolithic Microwave
Integrated Circuit) process. This process allows the
silicon pedestals, which form the series and shunt
diodes or vias, to be imbeded in low loss, low
dispersion glass. The combination of low loss glass
and using tight spacing between elements results in
an HMIC device with low loss and high isolation
through low millimeter wave frequencies.
Part Number
Package
MASW-002103-13630G
MASW-002103-13635P
MASW-002103-13630P
MASW-002103-001SMB
MASW-002103-002SMB
50 piece gel pack
500 piece reel
3000 piece reel
Sample Test Board
Demo Board with
MABT-011000 Bias Network
The topside is fully encapsulated with silicon nitride
and also has an additional layer of polymer for
scratch and impact protection. The protective
coating guards against damage to the junction and
the anode airbridges during handling and assembly.
On the backside of the chip gold metalized pads
have been added to produce a solderable surmount
device.
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.
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DC-0004853