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MAMF-011133 PDF预览

MAMF-011133

更新时间: 2024-11-05 14:55:23
品牌 Logo 应用领域
MACOM /
页数 文件大小 规格书
22页 1816K
描述
Integrated Dual Channel Switch and LNA Module 2 - 6 GHz

MAMF-011133 数据手册

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Integrated Dual Channel Switch and LNA Module  
2 - 6 GHz  
MAMF-011133  
Rev. V3  
Features  
Functional Schematic  
Dual Channel Architecture  
Broadband: 2 - 6 GHz  
High Power Switch Handling (TC = 105°C):  
43 dBm LTE 8 dB PAR (<10 s, single event)  
40 dBm LTE 8 dB PAR (Lifetime)  
Second LNA has Bypass Mode  
Rx High Gain Mode:  
Gain: 35 dB at 2.6 GHz, 34 dB @ 3.5 GHz  
NF: 1.3 dB at 2.6 GHz, 1.5 dB @ 3.5 GHz  
OIP3: 35.5 dBm  
Rx Low Gain Mode:  
Gain: 19.3 dB at 2.6 GHz, 19.5 dB @ 3.5 GHz  
NF: 1.2 dB at 2.6 GHz, 1.5 dB @ 3.5 GHz  
OIP3: 30.5 dBm  
Single 5 V Supply, 115 mA per channel  
Compatible with 1.8 V and 3.3 V logic  
Lead-Free 6 mm 40-Lead QFN Package  
RoHS* Compliant  
Applications  
Pin Configuration2,3,4  
5G Massive MIMO  
Wireless Infrastructure  
TDD-based communication systems  
1, 2, 4, 7, 9-11, 13, 14, 21,  
Ground  
23, 28, 30, 37, 38, 40  
3
5
Antenna Input ChA  
Description  
Switch Control ChA & B  
No Connect  
The highly integrated Dual Channel Switch and LNA  
Module includes two Antenna Switches and two  
2-stage low noise amplifiers in a compact low cost  
6 mm QFN package. The second stage LNAs can  
be bypassed. Mixed technologies are used to  
achieve high power handling, low noise figure, and  
low power consumption. The module only needs a  
single +5 V supply. T/R switch, LNA enable, and  
bypass function can be controlled with 1.8 V or 3.3 V  
logic.  
6, 15, 16, 18-20, 25, 31-33,  
35, 36  
8
Antenna Input ChB  
Load ChB  
12  
17  
22  
24  
26  
27  
29  
34  
39  
VDD ChB  
Rx Output ChB  
LNA Bypass ChB  
LNA Enable ChA & B  
LNA Bypass ChA  
Rx Output ChA  
VDD ChA  
Ordering Information1  
MAMF-011133-TR1000  
MAMF-011133-001SMB  
1000 part reel  
Sample Board  
Load ChA  
1. Reference Application Note M513 for reel size information.  
2. Blocking Capacitors are required on all RF Ports.  
3. MACOM recommends connecting unused package pins to  
ground.  
4. The exposed pad centered on the package bottom must be  
connected to RF, DC and thermal ground.  
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
DC-0020801  

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