Datasheet > MADP-0XX025-1314

MADP-0XX025-1314

更新时间： 2024-09-15 12:56:31

品牌	Logo	应用领域
泰科 - TE		二极管
页数	文件大小	规格书
4页	167K
描述
SURMOUNTâ¢ 25Î¼M PIN Diodes

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MADP-0XX025-1314 数据手册

MADP-017025-1314

MADP-030025-1314

SURMOUNT™ 25µM PIN Diodes

RoHS Compliant

Rev. V5

Case Style ODS 1314

Features

♦ 0603 Outline

♦ Surface Mount

♦ 25µm I-Region Length Devices

♦ No Wirebonds Required

♦ Silicon Nitride Passivation

♦ Polymer Scratch Protection

♦ Low Parasitic Capacitance and Inductance

♦ High Average and Peak Power Handling

Description

This device is a silicon, glass PIN diode surmount chip

fabricated with M/A-COM’s patented HMIC^TMprocess.

This device features two silicon pedestals embedded in a

low loss, low dispersion glass. The diode is formed on the

top of one pedestal and connections to the backside of the

device are facilitated by making the pedestal sidewalls

electrically conductive. Selective backside metallization is

applied producing a surface mount device. This vertical

topology provides for exceptional heat transfer. The

topside is fully encapsulated with silicon nitride and has an

additional polymer layer for scratch and impact protection.

These protective coatings prevent damage to the junction

and the anode air-bridge during handling and assembly.

Applications

These packageless devices are suitable for usage in

moderate incident power, ≤50dBm/C.W. or where the peak

power is ≤75dBm, pulse width is 1µS, and duty cycle is

0.01%. Their low parasitic inductance, 0.4 nH, and

excellent RC constant, make these devices a superior

choice for higher frequency switch elements when

compared to their plastic package counterparts.

Chip Dimensions

DIM

INCHES

Min

Max

Min

Max

0.060

0.031

0.004

0.019

0.029

0.062

0.032

0.008

0.021

0.031

1.525

0.775

0.102

0.475

0.725

1.575

0.825

0.203

0.525

0.775

Absolute Maximum Ratings¹@ TA = +25°C

(unless otherwise specified)

Parameter

Forward Current

Absolute Maximum

500 mA

Reverse Voltage

- 135 V

Operating Temperature

Storage Temperature

Junction Temperature

-55°C to +125°C

-55 °C to +150°C

+175°C

+44dBm MADP-017025

+47dBM MADP-030025

Notes:

C.W. Incident Power

1) Backside metal: 0.1microns thick.

2) Yellow area with hatch lines indicate backside ohmic gold

contacts.

Peak Incident Power (dBm) +50 dBm, 10µS, 1% duty

Mounting Temperature +280°C for 30 seconds

3) Both devices have same outline dimensions ( A to G).

1) Exceeding these limits may cause permanent damage

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.4155721

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

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