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MA18120JAN PDF预览

MA18120JAN

更新时间: 2024-10-31 16:56:23
品牌 Logo 应用领域
村田 - MURATA 电容器
页数 文件大小 规格书
6页 240K
描述
CAPACITOR, CERAMIC, MULTILAYER, 150V, P90, 0.000012uF, SURFACE MOUNT, 0606, CHIP

MA18120JAN 技术参数

生命周期:Obsolete包装说明:, 0606
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8532.24.00.20风险等级:5.84
电容:0.000012 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMICJESD-609代码:e4
安装特点:SURFACE MOUNT多层:Yes
负容差:5%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE包装方法:TR, PLASTIC, 7 INCH
正容差:5%额定(直流)电压(URdc):150 V
尺寸代码:0606表面贴装:YES
温度特性代码:P90温度系数:90+/-20ppm/Cel ppm/ °C
端子面层:SILVER PALLADIUM端子形状:WRAPAROUND
Base Number Matches:1

MA18120JAN 数据手册

 浏览型号MA18120JAN的Datasheet PDF文件第2页浏览型号MA18120JAN的Datasheet PDF文件第3页浏览型号MA18120JAN的Datasheet PDF文件第4页浏览型号MA18120JAN的Datasheet PDF文件第5页浏览型号MA18120JAN的Datasheet PDF文件第6页 
APPLICATION SPECIFIC CAPACITORS  
HIGH FREQUENCY CERAMIC CAPACITORS  
MA/MB Series  
OUTSTANDING CHARACTERISTICS  
Miniature size  
Very high Q at high frequencies  
High RF power capabilities  
Impervious to environmental conditions  
Low dissipation factors  
Excellent retrace capability (not applicable for X7R styles)  
High temperature stability  
Low noise  
Meets Mil-55681 with respect to: Shock, Vibration,  
Moisture Resistance, Solderability, Barometric Pressure,  
Temperature Cycling, Immersion and Salt Spray  
ADDITIONAL FEATURES  
Packaging options  
Lot processing data available  
MA SERIES  
For filtering, coupling and impedance matching in most  
RF circuits, the MA Series chips and leaded devices offer  
outstanding performance and reliability with the greatest  
range of values and configurations. MA Series capacitors  
can be supplied with military equivalent screening. Please  
consult our factory.  
easy to apply and have excellent reliability. Units are  
available in ultra-miniature case size 1 (1.4 x 1.4 x 1.4mm)  
or miniature case size 2 (2.8 x 2.8 x 2.5mm). Standard  
case size 1 units are available as chips. Standard case  
size 2 units are available as chips and also in leaded  
configurations.  
MA Series ceramic fixed capacitors are miniature, high  
performance precision components having extremely high Q  
and high power capabilities from low frequencies to gigahertz  
ranges. These “low loss” multilayer capacitors are extremely  
stable with respect to variations in temperature, voltage and  
frequency.  
Clean-room manufacturing technology assures product  
reliability and automated processing reduces costs and  
cycle time. Key stages of the operation are monitored  
and controlled with the latest SPC techniques. Flexibility in  
design allows the production of non-standard values, while  
maintaining consistent quality objectives.  
MA Series capacitors are designed for miniature  
state-of-the-art circuit applications. They are small,  
Please contact the factory for availability of special  
configurations or high-reliability screening.  
PART NUMBERING SYSTEM – CASE SIZE 1 & CASE SIZE 2  
M
A
1
8
101  
J
A
N
CUBIC  
A-STD SERIES DIMENSIONAL  
TERMINATION  
CAPACITANCE  
TOLERANCES:  
*B: ±±0.pꢀ  
A: NO  
7Reel  
MONOLITHIC B-ULTRA  
HIGH Q  
AND T.C. CODE CODE:  
CODE: Expressed  
in picofarads and  
MARKING  
Plastic  
.: P9± Case .  
2: COG Case .  
7: X7R Case .  
ꢁ: P9± Case ꢁ  
6: COG Case ꢁ  
8: X7R Case ꢁ  
±: Chip  
.: Pellet  
*C: ±±0ꢁ2pꢀ  
B: MARKING Tape  
Cap0 Code  
& Tol0  
identified by a three-digit *D: ±±02pꢀ  
ꢁ: Microstrip  
3: Radial Ribbon  
4: Radial Wire  
2: Axial Ribbon  
6: Narrow Axial Ribbon  
7: Axial Wire  
number0 ꢀirst two digits  
represent significant  
figures0 Last digit  
ꢀ: ±.1  
G: ±ꢁ1  
Logo if space  
permits  
J: ±21  
specifies the number  
of zeros to follow0 ꢀor  
values below .±p,  
K: ±.±1  
M: ±ꢁ±1  
Z: +8±1, –ꢁ±1  
Non XR7  
styles only  
8: Nickel Interfaced Pellet the letter “R” is used  
9: Nickel Interfaced Chip  
as the decimal point  
and the last digit  
becomes significant0  
*Available  
below .±pf  
only  
SPECIAL LEAD CONFIGURATION FOR FLEX BOARDS  
NOTE: Targeted for flex circuit boards, the MA22-6 version of the MA22 has an upraised lead configuration. The lead bends  
when flexing the board after assembly so that minimal stress is placed on the component.  
Type  
Dimensions: mm  
Style  
Band  
Y
Termination  
Configuration  
P90 ± ±0 P90 ± ꢀ0  
COG  
X7R  
L ± 0.8* W ± 0.8* T ± .0ꢀ8  
L
W
Silver Ribbon:  
T
Length: 6.35 typical  
Width: 2.3 .13  
Raised  
Micro-Strip  
3.4  
2.8  
2.8  
0.38 .25  
MA22-6 MB22-6 MA62-6 MA82-6  
Thickness: 0.1 .05  
Y
118  
CG01-J  

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