Material Content Data Sheet
Sales Product Name ICE3B0365J-T
Issued
29. August 2013
556.90 mg
MA#
MA001050108
PG-DIP-8-13
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
2.248
0.054
0.40
0.01
0.04
0.77
31.33
0.05
0.20
6.37
59.08
1.35
0.14
0.04
0.22
0.40
4037
96
4037
leadframe
phosphorus
zinc
0.215
386
iron
4.297
7716
313296
483
copper
174.475
0.269
32.15
0.05
321494
483
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
1.097
1969
63680
590850
13460
1429
390
35.464
329.045
7.496
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
65.65
1.35
0.14
656499
13460
1429
leadfinish
plating
glue
silver
0.796
plastics
epoxy resin
silver
0.217
noble metal
7440-22-4
1.230
0.26
2208
2598
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com