Material Content Data Sheet
Sales Product Name IPA65R660CFD
Issued
29. August 2013
2240.21 mg
MA#
MA001042650
Package
PG-TO220-3-111
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
3.294
0.687
0.15
0.03
0.01
30.63
0.03
0.10
9.28
40.00
0.35
0.01
0.00
0.01
0.02
0.06
0.01
0.02
19.29
0.15
1470
307
1470
leadframe
iron
phosphorus
copper
0.206
92
686.221
0.705
30.67
0.03
306321
315
306720
315
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
2.212
987
207.943
895.924
7.942
92823
399928
3545
136
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
49.38
0.35
493739
3545
leadfinish
plating
nickel
0.305
phosphorus
antimony
silver
0.001
0.01
0.09
1
136
935
solder
0.209
93
0.523
234
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
tin
1.361
608
heatspreader
*deviation
phosphorus
iron
0.130
58
0.433
193
copper
432.110
19.32
192889
193140
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com