Material Content Data Sheet
Sales Product Name SPA15N65C3
Issued
28. August 2013
2259.59 mg
MA#
MA000870628
Package
PG-TO220-3-31
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7440-66-6
7440-50-8
7429-90-5
1333-86-4
-
9.195
0.925
0.41
0.04
27.25
0.15
0.10
9.34
40.22
0.27
0.03
0.02
0.05
0.12
0.03
21.97
0.41
4069
409
4069
leadframe
zinc
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
615.788
3.363
27.29
0.15
272522
1488
993
272931
1488
wire
encapsulation
2.244
210.950
908.881
6.173
93358
402234
2732
297
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7440-66-6
7440-50-8
49.66
0.27
0.03
496585
2732
297
leadfinish
plating
nickel
0.671
solder
antimony
silver
0.432
191
1.080
478
non noble metal
non noble metal
non noble metal
< 10%
tin
2.807
0.19
1242
330
1911
heatspreader
*deviation
zinc
0.746
copper
496.335
22.00
219657
219987
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com