Material Content Data Sheet
Sales Product Name BC 847B E6327
Issued
29. August 2013
8.82 mg
MA#
MA000960692
Package
PG-SOT23-3-16
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
noble metal
gold
7440-57-5
7440-38-2
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-57-5
1333-86-4
-
0.003
0.000
0.025
0.008
0.001
0.003
2.731
0.014
0.058
0.087
0.116
1.244
4.283
0.150
0.100
0.03
0.00
0.28
0.09
0.01
0.03
30.96
0.16
0.66
0.98
1.31
14.11
48.55
1.70
1.13
332
3
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
arsenic
silicon
0.31
2840
933
3175
leadframe
chromium
silicon
62
titanium
311
copper
31.09
0.16
309564
1623
310870
1623
wire
gold
encapsulation
organic material
plastics
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
6561
9841
inorganic material
plastics
1309-64-4
-
13121
141056
485496
16963
11294
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
65.61
1.70
1.13
656075
16963
leadfinish
plating
silver
11294
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com