Material Content Data Sheet
Sales Product Name IPB80N04S3-04
Issued
29. August 2013
1463.64 mg
MA#
MA000366353
PG-TO263-3-2
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
4.719
0.853
0.256
851.691
5.867
8.800
96.796
481.045
9.657
0.228
0.001
0.093
0.075
3.558
0.32
0.06
0.02
58.18
0.40
0.60
6.61
32.87
0.66
0.02
0.00
0.01
0.01
0.24
0.32
3224
583
3224
leadframe
iron
phosphorus
copper
175
58.26
0.40
581901
4009
6012
66133
328663
6598
156
582659
4009
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
40.08
0.66
400808
6598
leadfinish
plating
nickel
phosphorus
silver
0.02
0
156
solder
64
non noble metal
non noble metal
< 10%
tin
51
lead
0.26
2431
2546
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com