Advanced v0.8
®
Fusion Family of Mixed-Signal Flash FPGAs
®
with Optional Soft ARM Support
Low Power Consumption
Features and Benefits
High-Performance Reprogrammable Flash Technology
•
•
Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
Sleep and Standby Low Power Modes
•
•
•
•
Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
Nonvolatile, Retains Program when Powered Off
Live at Power-Up (LAPU) Single-Chip Solution
350 MHz System Performance
In-System Programming (ISP) and Security
•
•
Secure ISP with 128-Bit AES via JTAG
FlashLock to Secure FPGA Contents
®
Advanced Digital I/O
Embedded Flash Memory
•
•
•
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages – Up to 5 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V /1.8 V /
1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS
•
User Flash Memory – 2 Mbits to 8 Mbits
–
–
Configurable 8-, 16-, or 32-Bit Datapath
10 ns Access in Read-Ahead Mode
•
1 kbit of Additional FlashROM
•
Integrated A/D Converter (ADC) and Analog I/O
–
–
Built-In I/O Registers
700 Mbps DDR Operation
•
•
•
•
•
•
Up to 12-Bit Resolution and up to 600 ksps
Internal 2.56 V or External Reference Voltage
ADC: Up to 30 Scalable Analog Input Channels
High-Voltage Input Tolerance: 12 V
Current Monitor and Temperature Monitor Blocks
Up to 10 MOSFET Gate Driver Outputs
•
•
Hot-Swappable I/Os
Programmable Output Slew Rate, Drive Strength, and Weak
Pull-Up/Down Resistor
•
Pin-Compatible Packages across the Fusion Family
SRAMs and FIFOs
–
–
P- and N-Channel Power MOSFET Support
Programmable 1, 3, 10, 30 µA and 25 mA Drive Strengths
•
Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
On-Chip Clocking Support
•
•
True Dual-Port SRAM (except ×18)
Programmable Embedded FIFO Control Logic
•
•
•
•
Internal 100 MHz RC Oscillator (accurate to 1%)
Crystal Oscillator Support (32 kHz to 20 MHz)
Programmable Real-Time Counter (RTC)
Soft ARM7™ Core Support in M7 and M1 Fusion Devices
•
CortexM1(without debug), CoreMP7Sd (with debug) and
CoreMP7S (without debug)
6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated PLLs
–
–
Phase Shift, Multiply/Divide, and Delay Capabilities
Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz
Table 1 •
Fusion Family
Fusion Devices
AFS090
AFS250
AFS600
AFS1500
1
M7AFS600
CoreMP7
Cortex-M1
ARM-Enabled
Fusion Devices
2
M1AFS250
M1AFS600
M1AFS1500
System Gates
90,000
2,304
Yes
1
250,000
6,144
Yes
1
600,000
13,824
Yes
2
1,500,000
Tiles (D-flip-flops)
Secure (AES) ISP
PLLs
38,400
Yes
2
General
Information
Globals
18
1
18
18
18
Flash Memory Blocks (2 Mbits)
Total Flash Memory Bits
FlashROM Bits
1
2
4
2 M
1 k
6
2 M
1 k
8
4 M
1 k
24
8 M
1 k
60
Memory
RAM Blocks (4,608 bits)
RAM kbits
27
5
36
108
10
270
10
Analog Quads
6
Analog Input Channels
Gate Driver Outputs
I/O Banks (+ JTAG)
Maximum Digital I/Os
Analog I/Os
15
5
18
30
30
6
10
10
Analog and I/Os
4
4
5
5
75
20
114
24
172
40
252
40
Notes:
1. Refer to the CoreMP7 datasheet for more information.
2. Refer to the Cortex-M1 product brief for more information.
June 2007
i
© 2007 Actel Corporation
See the Actel website for the latest version of the datasheet.