品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 闪存 | |
页数 | 文件大小 | 规格书 |
53页 | 415K | |
描述 | ||
4-Mbit (512 Kb x8, uniform block) 3-V supply firmware hub Flash memory |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | QFJ | 包装说明: | ROHS COMPLIANT, PLASTIC, LCC-32 |
针数: | 32 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.82 | 最长访问时间: | 11 ns |
命令用户界面: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PQCC-J32 | JESD-609代码: | e3 |
长度: | 13.97 mm | 内存密度: | 4194304 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
功能数量: | 1 | 部门数/规模: | 8 |
端子数量: | 32 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -20 °C |
组织: | 512KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | QCCJ | 封装等效代码: | LDCC32,.5X.6 |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 245 |
电源: | 3.3 V | 编程电压: | 3 V |
认证状态: | Not Qualified | 就绪/忙碌: | YES |
座面最大高度: | 3.56 mm | 最大待机电流: | 0.0001 A |
子类别: | Flash Memories | 最大压摆率: | 0.06 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | MATTE TIN | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 切换位: | NO |
类型: | NOR TYPE | 宽度: | 11.43 mm |
Base Number Matches: | 1 |
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4 Mbit 512Kb x8, Uniform Block 3V Supply Firmware Hub Flash Memory | |
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暂无描述 | |
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4-Mbit (512 Kb x8, uniform block) 3-V supply firmware hub Flash memory |