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M48T254V-10ZA1 PDF预览

M48T254V-10ZA1

更新时间: 2024-11-11 21:14:39
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 双倍数据速率外围集成电路
页数 文件大小 规格书
24页 255K
描述
REAL TIME CLOCK, PBGA168, 42.50 X 42.50 MM, 1.27 MM PITCH, BGA-168

M48T254V-10ZA1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:BGA, BGA168,19X23,50针数:168
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.77
外部数据总线宽度:8信息访问方法:PARALLEL, DIRECT ADDRESS
中断能力:NJESD-30 代码:S-PBGA-B168
JESD-609代码:e3长度:42.5 mm
湿度敏感等级:1端子数量:168
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA168,19X23,50封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):225
电源:3.3 V认证状态:Not Qualified
座面最大高度:11.88 mm子类别:Timer or RTC
最大供电电压:3.6 V最小供电电压:2.7 V
标称供电电压:3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:MATTE TIN端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
最短时间:1/100 SECOND处于峰值回流温度下的最长时间:NOT SPECIFIED
易失性:NO宽度:42.5 mm
uPs/uCs/外围集成电路类型:TIMER, REAL TIME CLOCKBase Number Matches:1

M48T254V-10ZA1 数据手册

 浏览型号M48T254V-10ZA1的Datasheet PDF文件第2页浏览型号M48T254V-10ZA1的Datasheet PDF文件第3页浏览型号M48T254V-10ZA1的Datasheet PDF文件第4页浏览型号M48T254V-10ZA1的Datasheet PDF文件第5页浏览型号M48T254V-10ZA1的Datasheet PDF文件第6页浏览型号M48T254V-10ZA1的Datasheet PDF文件第7页 
M48T254V  
®
3.3V, 16 Mbit (2 Mb x 8 bit) TIMEKEEPER  
SRAM WITH PHANTOM CLOCK  
FEATURES SUMMARY  
3.3V ± 10%  
Figure 1. 168-ball PBGA Module  
INTEGRATED ULTRA LOW POWER SRAM,  
REAL TIME CLOCK, POWER-FAIL CONTROL  
CIRCUIT, BATTERY AND CRYSTAL  
REAL TIME CLOCK KEEPS TRACK OF  
TENTHS/HUNDREDTHS OF SECONDS,  
SECONDS, MINUTES, HOURS, DAYS, DATE,  
MONTHS, and YEARS.  
CLOCK FUNCTION IS TRANSPARENT TO  
RAM OPERATION.  
PRECISION POWER MONITORING and  
POWER SWITCHING CIRCUITRY  
168-ball PBGA  
Module (ZA)  
AUTOMATIC WRITE-PROTECTION WHEN  
V
IS OUT-OF-TOLERANCE  
CC  
POWER-FAIL DESELECT VOLTAGE:  
– V = 3.3V ± 10%; 2.8V V  
2.97V  
PFD  
CC  
Figure 2. SNAPHAT Crystal/Battery  
BATTERY LOW (BL)  
10 YEARS of DATA RETENTION and CLOCK  
OPERATION IN THE ABSENCE OF POWER  
SNAPHAT HOUSING (BATTERY/CRYSTAL)  
IS REPLACEABLE  
SNAPHAT (SH)  
Crystal/Battery  
100ns ACCESS (READ = WRITE)  
May 2003  
1/24  
Rev. 2.0  

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