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M390S6450CT1-C7A PDF预览

M390S6450CT1-C7A

更新时间: 2024-01-07 21:04:42
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管动态存储器
页数 文件大小 规格书
12页 222K
描述
64Mx72 SDRAM DIMM with PLL & Register based on 64Mx4, 4Banks, 8K Ref., 3.3V Synchronous DRAMs with SPD

M390S6450CT1-C7A 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIMM包装说明:DIMM, DIMM168
针数:168Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.92Is Samacsys:N
访问模式:SINGLE BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMONJESD-30 代码:R-XDMA-N168
内存密度:4831838208 bit内存集成电路类型:SYNCHRONOUS DRAM MODULE
内存宽度:72湿度敏感等级:1
功能数量:1端口数量:1
端子数量:168字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64MX72输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM168封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):225
电源:3.3 V认证状态:Not Qualified
刷新周期:8192自我刷新:YES
最大待机电流:0.038 A子类别:DRAMs
最大压摆率:2.75 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

M390S6450CT1-C7A 数据手册

 浏览型号M390S6450CT1-C7A的Datasheet PDF文件第6页浏览型号M390S6450CT1-C7A的Datasheet PDF文件第7页浏览型号M390S6450CT1-C7A的Datasheet PDF文件第8页浏览型号M390S6450CT1-C7A的Datasheet PDF文件第9页浏览型号M390S6450CT1-C7A的Datasheet PDF文件第10页浏览型号M390S6450CT1-C7A的Datasheet PDF文件第11页 
M390S6450CT1  
PC133 Registered DIMM  
SERIAL PRESENCE DETECT INFORMATION  
Function Supported  
Hex value  
Note  
Byte #  
Function described  
-7C  
-7A  
-7C  
-7A  
35  
Data signal input hold time  
0.8ns  
08h  
00h  
02h  
36~61 Superset information (maybe used in future)  
-
62  
63  
64  
SPD data revision code  
JEDEC 2  
Checksum for bytes 0 ~ 62  
Manufacturer JEDEC ID code  
-
EBh  
2Ch  
Samsung  
CEh  
00h  
01h  
4Dh  
33h  
20h  
39h  
30h  
53h  
36h  
34h  
35h  
30h  
43h  
54h  
31h  
2Dh  
43h  
65~71 ...... Manufacturer JEDEC ID code  
Samsung  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
Manufacturing location  
Onyang Korea  
Manufacturer part # (Memory module)  
Manufacturer part # (DIMM Configuration)  
Manufacturer part # (Data bits)  
M
3
Blank  
...... Manufacturer part # (Data bits)  
...... Manufacturer part # (Data bits)  
Manufacturer part # (Mode & operating voltage)  
Manufacturer part # (Module depth)  
...... Manufacturer part # (Module depth)  
Manufacturer part # (Refresh, #of banks in Comp. & Inter-  
Manufacturer part # (Composition component)  
Manufacturer part # (Component revision)  
Manufacturer part # (Package type)  
Manufacturer part # (PCB revision & type)  
Manufacturer part # (Hyphen)  
9
0
S
6
4
5
0
C
T
1
" - "  
C
Manufacturer part # (Power)  
Manufacturer part # (Minimum cycle time)  
Manufacturer part # (Minimum cycle time)  
Manufacturer part # (TBD)  
7
7
37h  
43h  
37h  
41h  
C
A
Blank  
1
20h  
Manufacturer revision code (For PCB)  
...... Manufacturer revision code (For component)  
Manufacturing date (Year)  
31h  
C-die (4th Gen.)  
43h  
-
-
3
3
4
5
Manufacturing date (Week)  
-
-
95~98 Assembly serial #  
-
Undefined  
-
-
99~125 Manufacturer specific data (may be used in future)  
126  
127  
System frequency for 100MHz  
Intel Specification details  
Unused storage locations  
100MHz  
64h  
8Fh  
-
Detailed 100MHz Information  
Undefined  
128+  
5
Note :  
1. The row select address is excluded in counting the total # of addresses.  
2. This value is based on the component specification.  
3. These bytes are programmed by code of Date Week & Date Year with BCD format.  
4. These bytes are programmed by Samsung ¢s own Assembly Serial # system. All modules may have different unique serial #.  
5. These bytes are Undefined and can be used for Samsungs own purpose.  
Rev. 0.2 Sept. 2001  

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