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M30LW128D110ZE6F PDF预览

M30LW128D110ZE6F

更新时间: 2024-10-28 17:57:27
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 内存集成电路
页数 文件大小 规格书
58页 889K
描述
Flash Module, 8MX16, 110ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, LFBGA-88

M30LW128D110ZE6F 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BGA包装说明:8 X 10 MM, 0.80 MM PITCH, LEAD FREE, LFBGA-88
针数:88Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.55最长访问时间:110 ns
备用内存宽度:8命令用户界面:YES
通用闪存接口:YES数据轮询:NO
JESD-30 代码:R-PBGA-B88JESD-609代码:e1
长度:10 mm内存密度:134217728 bit
内存集成电路类型:FLASH MODULE内存宽度:16
功能数量:1端子数量:88
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA88,8X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH页面大小:4 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3/3.3 V编程电压:3.3 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.00008 A子类别:Flash Memories
最大压摆率:0.03 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:NO类型:NOR TYPE
宽度:8 mmBase Number Matches:1

M30LW128D110ZE6F 数据手册

 浏览型号M30LW128D110ZE6F的Datasheet PDF文件第2页浏览型号M30LW128D110ZE6F的Datasheet PDF文件第3页浏览型号M30LW128D110ZE6F的Datasheet PDF文件第4页浏览型号M30LW128D110ZE6F的Datasheet PDF文件第5页浏览型号M30LW128D110ZE6F的Datasheet PDF文件第6页浏览型号M30LW128D110ZE6F的Datasheet PDF文件第7页 
M30LW128D  
128 Mbit (two 64Mbit, x8/x16, Uniform Block, Flash Memories)  
3V Supply, Multiple Memory Product  
FEATURES SUMMARY  
TWO M58LW064D 64Mbit FLASH  
MEMORIES STACKED IN A SINGLE  
PACKAGE  
Figure 1. Packages  
WIDE x8 or x16 DATA BUS for HIGH  
BANDWIDTH  
SUPPLY VOLTAGE  
VDD = 2.7 to 3.6V for Program, Erase and  
Read operations  
VDDQ = 1.8 to VDD for I/O buffers  
TSOP56 (N)  
14 x 20 mm  
ACCESS TIME  
Random Read 110ns  
Page Mode Read 110/25ns  
PROGRAMMING TIME  
128 UNIFORM 64 KWord/128KByte  
MEMORY BLOCKS  
BLOCK PROTECTION/ UNPROTECTION  
PROGRAM and ERASE SUSPEND  
128 bit PROTECTION REGISTER  
COMMON FLASH INTERFACE  
TBGA  
16 Word Write Buffer  
16µs Word effective programming time  
TBGA64 (ZA)  
10 x 13mm  
100, 000 PROGRAM/ERASE CYCLES per  
BLOCK  
FBGA  
ELECTRONIC SIGNATURE  
Manufacturer Code: 0020h  
Device Code M30LW128D: 8817h  
LFBGA88 (ZE)  
8 x 10mm  
PACKAGES  
Compliant with Lead-Free Soldering  
Processes  
Lead-Free Versions  
September 2004  
1/58  

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