品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 内存集成电路 | |
页数 | 文件大小 | 规格书 |
58页 | 889K | |
描述 | ||
Flash Module, 8MX16, 110ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, LFBGA-88 |
是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, LFBGA-88 |
针数: | 88 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.55 | 最长访问时间: | 110 ns |
备用内存宽度: | 8 | 命令用户界面: | YES |
通用闪存接口: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PBGA-B88 | JESD-609代码: | e1 |
长度: | 10 mm | 内存密度: | 134217728 bit |
内存集成电路类型: | FLASH MODULE | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 88 |
字数: | 8388608 words | 字数代码: | 8000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 8MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装等效代码: | BGA88,8X12,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 页面大小: | 4 words |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 3/3.3 V | 编程电压: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大待机电流: | 0.00008 A | 子类别: | Flash Memories |
最大压摆率: | 0.03 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
切换位: | NO | 类型: | NOR TYPE |
宽度: | 8 mm | Base Number Matches: | 1 |
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