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M29W800B-90N1R PDF预览

M29W800B-90N1R

更新时间: 2024-11-17 19:51:07
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 可编程只读存储器光电二极管内存集成电路
页数 文件大小 规格书
33页 272K
描述
1MX8 FLASH 3V PROM, 90ns, PDSO48, 12 X 20 MM, PLASTIC, REVERSE, TSOP-48

M29W800B-90N1R 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:12 X 20 MM, PLASTIC, REVERSE, TSOP-48
针数:48Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.7最长访问时间:90 ns
其他特性:BOTTOM BOOT BLOCK备用内存宽度:16
启动块:BOTTOM命令用户界面:YES
数据轮询:YES耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
长度:18.4 mm内存密度:8388608 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:1,2,1,15
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1-R封装等效代码:TSSOP48,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
反向引出线:YES座面最大高度:1.2 mm
部门规模:16K,8K,32K,64K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.02 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:12 mm
Base Number Matches:1

M29W800B-90N1R 数据手册

 浏览型号M29W800B-90N1R的Datasheet PDF文件第2页浏览型号M29W800B-90N1R的Datasheet PDF文件第3页浏览型号M29W800B-90N1R的Datasheet PDF文件第4页浏览型号M29W800B-90N1R的Datasheet PDF文件第5页浏览型号M29W800B-90N1R的Datasheet PDF文件第6页浏览型号M29W800B-90N1R的Datasheet PDF文件第7页 
M29W800T  
M29W800B  
8 Mbit (1Mb x8 or 512Kb x16, Boot Block)  
Low Voltage Single Supply Flash Memory  
NOT FOR NEW DESIGN  
M29W800T and M29W800B are replaced  
respectively by the M29W800AT and  
M29W800AB  
2.7V to 3.6V SUPPLY VOLTAGE for  
PROGRAM, ERASE and READ OPERATIONS  
FAST ACCESS TIME: 90ns  
44  
FAST PROGRAMMING TIME  
– 10µs by Byte / 20µs by Word typical  
PROGRAM/ERASE CONTROLLER (P/E.C.)  
– Program Byte-by-Byte or Word-by-Word  
– Status Register bits and Ready/Busy Output  
MEMORY BLOCKS  
1
TSOP48 (N)  
12 x 20 mm  
SO44 (M)  
– Boot Block (Top or Bottom location)  
– Parameter and Main blocks  
BLOCK, MULTI-BLOCK and CHIP ERASE  
MULTI BLOCK PROTECTION/TEMPORARY  
UNPROTECTION MODES  
Figure 1. Logic Diagram  
ERASE SUSPEND and RESUME MODES  
– Read and Program another Block during  
Erase Suspend  
LOW POWER CONSUMPTION  
– Stand-by and Automatic Stand-by  
100,000 PROGRAM/ERASE CYCLES per  
BLOCK  
V
CC  
20 YEARS DATA RETENTION  
– Defectivity below 1ppm/year  
ELECTRONIC SIGNATURE  
19  
15  
A0-A18  
DQ0-DQ14  
– Manufacturer Code: 0020h  
– Device Code, M29W800T: 00D7h  
– Device Code, M29W800B: 005Bh  
W
E
DQ15A–1  
BYTE  
RB  
M29W800T  
M29W800B  
G
DESCRIPTION  
RP  
The M29W800 is a non-volatile memory that may  
be erased electrically at the block or chip level and  
programmed in-system on a Byte-by-Byte or Word-  
by-Word basis using only a single 2.7V to 3.6V VCC  
supply. For Program and Erase operations the  
necessary high voltages are generated internally.  
The device can also be programmed in standard  
programmers.  
V
SS  
AI02178  
The array matrix organisation allows each block to  
be erased and reprogrammed without affecting  
other blocks. Blocks can be protected against pro-  
graming and erase on programming equipment,  
June 1999  
1/33  
This is information on a product still in production but not recommended for new designs.  

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