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M29W640GH60NB6F PDF预览

M29W640GH60NB6F

更新时间: 2024-11-23 20:12:39
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 可编程只读存储器光电二极管内存集成电路闪存
页数 文件大小 规格书
90页 850K
描述
4MX16 FLASH 3V PROM, 60ns, PDSO56, 14 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-56

M29W640GH60NB6F 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:TSOP包装说明:TSSOP, TSSOP56,.8,20
针数:56Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.54最长访问时间:60 ns
备用内存宽度:8命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G56JESD-609代码:e3/e6
长度:18.4 mm内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:128
端子数量:56字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP56,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小:4/8 words并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:64K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.01 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:MATTE TIN/TIN BISMUTH端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:14 mm
Base Number Matches:1

M29W640GH60NB6F 数据手册

 浏览型号M29W640GH60NB6F的Datasheet PDF文件第2页浏览型号M29W640GH60NB6F的Datasheet PDF文件第3页浏览型号M29W640GH60NB6F的Datasheet PDF文件第4页浏览型号M29W640GH60NB6F的Datasheet PDF文件第5页浏览型号M29W640GH60NB6F的Datasheet PDF文件第6页浏览型号M29W640GH60NB6F的Datasheet PDF文件第7页 
M29W640GH M29W640GL  
M29W640GT M29W640GB  
64 Mbit (8Mb x8 or 4Mb x16, Page)  
3V supply Flash memory  
Feature  
FBGA  
Supply Voltage  
– V = 2.7 to 3.6 V for Program/Erase/Read  
CC  
– V =12 V for Fast Program (optional)  
PP  
TSOP48 (NA)  
12 x 20mm  
TFBGA48 (ZA)  
6 x 8mm  
Asynchronous Random/Page Read  
– Page Width: 4 words  
– Page Access: 25 ns  
FBGA  
– Random Access: 60 ns, 70 ns, 90 ns  
Fast Program commands  
– 2 word/4 byte Program (without V =12 V)  
PP  
TBGA64 (ZF)  
10 x 13mm(1)  
TSOP56 (NB)  
– 4 word/8 byte Program (with V =12 V)  
)
PP  
14 x 20mm(1  
– 16 word/32 byte Write Buffer  
1. Packages only available upon request.  
Programming time  
– 10 µs per byte/word typical  
– Chip Program time: 10 s (4-word Program)  
128 word Extended Memory block  
– Extra block used as security block or to  
store additional information  
Memory organization  
– M29W640GH/L:  
Low power consumption:Standby and  
128 main blocks, 64 Kbytes each  
Automatic Standby  
– M29W640GT/B  
Unlock Bypass Program command  
Eight 8 Kbytes Boot blocks (top or bottom)  
127 Main blocks, 64 Kbytes each  
– Faster Production/Batch Programming  
Program/Erase controller  
Common Flash Interface: 64-bit Security Code  
– Embedded byte/word program algorithms  
V /WP pin for Fast Program and Write Protect  
PP  
Program/Erase Suspend and Resume  
Temporary Block Unprotection mode  
100,000 Program/Erase cycles per block  
– Read from any block during Program  
Suspend  
Electronic Signature  
– Read and Program another block during  
Erase Suspend  
– Manufacturer Code: 0020h  
– Device code (see Table 1)  
®
ECOPACK packages  
Table 1.  
Device summary  
Root Part Number  
Device code  
M29W640GH: Uniform, last block protected by VPP/WP  
M29W640GL: Uniform, first block protected by VPP/WP  
M29W640GT: Top Boot Blocks  
227Eh + 220Ch + 2201h  
227Eh + 220Ch + 2200h  
227Eh + 2210h + 2201h  
227Eh + 2210h + 2200h  
M29W640GB: Bottom Boot Blocks  
February 2007  
Rev 4  
1/90  
www.st.com  
1

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