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M29W008DB70N1F PDF预览

M29W008DB70N1F

更新时间: 2023-01-02 17:52:08
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 光电二极管内存集成电路
页数 文件大小 规格书
34页 462K
描述
Flash, 1MX8, 70ns, PDSO40, 10 X 20 MM, LEAD FREE, PLASTIC, TSOP-40

M29W008DB70N1F 技术参数

生命周期:Obsolete零件包装代码:TSOP
包装说明:10 X 20 MM, LEAD FREE, PLASTIC, TSOP-40针数:40
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.68
最长访问时间:70 ns其他特性:BOTTOM BOOT BLOCK
启动块:BOTTOMJESD-30 代码:R-PDSO-G40
长度:18.4 mm内存密度:8388608 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1端子数量:40
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED类型:NOR TYPE
宽度:10 mm

M29W008DB70N1F 数据手册

 浏览型号M29W008DB70N1F的Datasheet PDF文件第2页浏览型号M29W008DB70N1F的Datasheet PDF文件第3页浏览型号M29W008DB70N1F的Datasheet PDF文件第4页浏览型号M29W008DB70N1F的Datasheet PDF文件第5页浏览型号M29W008DB70N1F的Datasheet PDF文件第6页浏览型号M29W008DB70N1F的Datasheet PDF文件第7页 
M29W008DT  
M29W008DB  
8 Mbit (1Mb x 8, Boot Block)  
3V Supply Flash Memory  
FEATURES SUMMARY  
SUPPLY VOLTAGE  
Figure 1. Package  
2.7V to 3.6V for Program, Erase and Read  
ACCESS TIMES: 70ns, 90ns  
PROGRAMMING TIME: 10µs per Byte typical  
PROGRAM/ERASE CONTROLLER (P/E.C.)  
Embedded Byte Program Algorithm  
Status Register bits and Ready/Busy  
Output  
19 MEMORY BLOCKS  
1 Boot Block (Top or Bottom location)  
2 Parameter and 16 Main Blocks  
TSOP40 (N)  
10 x 20mm  
BLOCK, MULTI-BLOCK and CHIP ERASE  
MULTIPLE BLOCK PROTECTION/  
TEMPORARY UNPROTECTION MODE  
ERASE SUSPEND and RESUME MODES  
LOW POWER CONSUMPTION  
Standby and Automatic Standby modes  
100,000 PROGRAM/ERASE CYCLES per  
BLOCK  
20 YEARS DATA RETENTION  
Defectivity below 1ppm/year  
ELECTRONIC SIGNATURE  
Manufacturer Code: 20h  
M29W008DT Device Code: D2h  
M29W008DB Device Code: DCh  
August 2004  
1/34  

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