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M24C32-WMN6/B PDF预览

M24C32-WMN6/B

更新时间: 2024-11-20 03:47:19
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
34页 290K
描述
128 Kbit, 64 Kbit and 32 Kbit serial I2C bus EEPROM

M24C32-WMN6/B 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOIC包装说明:0.150 INCH, PLASTIC, SOP-8
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.1最大时钟频率 (fCLK):0.4 MHz
数据保留时间-最小值:40耐久性:1000000 Write/Erase Cycles
I2C控制字节:1010DDDRJESD-30 代码:R-PDSO-G8
JESD-609代码:e0长度:4.9 mm
内存密度:32768 bit内存集成电路类型:EEPROM
内存宽度:8功能数量:1
端子数量:8字数:4096 words
字数代码:4000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4KX8封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL峰值回流温度(摄氏度):240
电源:3/5 V认证状态:Not Qualified
筛选级别:AEC-Q100座面最大高度:1.75 mm
串行总线类型:I2C最大待机电流:0.000002 A
子类别:EEPROMs最大压摆率:0.005 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):2.7 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:3.9 mm
最长写入周期时间 (tWC):5 ms写保护:HARDWARE
Base Number Matches:1

M24C32-WMN6/B 数据手册

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M24128  
M24C64 M24C32  
128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM  
Feature summary  
2
Two-Wire I C serial interface  
Supports 400kHz Protocol  
Single supply voltages (see Table 1 for root  
part numbers):  
– 2.5 to 5.5V  
– 1.8 to 5.5V  
– 1.7 to 5.5V  
PDIP8 (BN)  
Write Control Input  
Byte and Page Write  
Random And Sequential Read modes  
Self-Timed programming cycle  
Automatic address incrementing  
Enhanced ESD/Latch-Up Protection  
More than 1 Million Write cycles  
More than 40-year data retention  
SO8 (MN)  
150 mil width  
Packages  
– ECOPACK® (RoHS compliant)  
TSSOP8 (DW)  
169 mil width  
Table 1.  
Product list  
Reference  
Root part number Supply voltage  
M24128-BW  
M24128-BR  
M24C64-W  
M24C64-R  
M24C64-F  
M24C32-W  
M24C32-R  
M24C32-F  
2.5 to 5.5V  
1.8 to 5.5V  
2.5 to 5.5V  
1.8 to 5.5V  
1.7 to 5.5V  
2.5 to 5.5V  
1.8 to 5.5V  
1.7 to 5.5V  
M24128  
M24C64  
UFDFPN8 (MB)  
2x3mm² (MLP)  
M24C32  
October 2006  
Rev 9  
1/34  
www.st.com  
1

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