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M24C16-DFCU6TP/K PDF预览

M24C16-DFCU6TP/K

更新时间: 2024-11-13 17:33:15
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
35页 563K
描述
16 Kbit串行I2C总线EEPROM

M24C16-DFCU6TP/K 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:VFBGA,Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:6 weeks
风险等级:1.68最大时钟频率 (fCLK):0.4 MHz
JESD-30 代码:R-PBGA-B4长度:0.819 mm
内存密度:16384 bit内存集成电路类型:EEPROM
内存宽度:8功能数量:1
端子数量:4字数:2048 words
字数代码:2000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:2KX8封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH并行/串行:SERIAL
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:0.3 mm
串行总线类型:I2C最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.6 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.4 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:0.725 mm
Base Number Matches:1

M24C16-DFCU6TP/K 数据手册

 浏览型号M24C16-DFCU6TP/K的Datasheet PDF文件第2页浏览型号M24C16-DFCU6TP/K的Datasheet PDF文件第3页浏览型号M24C16-DFCU6TP/K的Datasheet PDF文件第4页浏览型号M24C16-DFCU6TP/K的Datasheet PDF文件第5页浏览型号M24C16-DFCU6TP/K的Datasheet PDF文件第6页浏览型号M24C16-DFCU6TP/K的Datasheet PDF文件第7页 
M24C16-DFCU  
16-Kbit serial I²C bus EEPROM 4 balls CSP  
Datasheet - preliminary data  
Features  
Package:  
– RoHS compliant and halogen free  
®
WLCSP(ECOPACK2 )  
Compatible with all I2C bus modes  
– 1 MHz  
– 400 kHz  
Memory array:  
WLCSP (CU)  
– 16 Kbits (2 Kbytes) of EEPROM  
– Page size: 16 bytes  
– Additional Write lockable  
page(Identification page)  
Supply voltage range:  
– 1.6 V to 5.5 V  
Operating temperature range  
– V = 1.7 V : -40°C / +85°C  
CC  
– V = 1.6 V : -40°C (Read) / 0°C (Write) /  
CC  
+85°C  
Schmitt trigger inputs for noise filtering  
Write  
– Byte Write within 5 ms  
– Page Write within 5 ms  
Random and sequential read modes  
ESD protection  
– Human Body Model: 4 kV  
Write cycle endurance  
– 4 million Write cycles at 25 °C  
– 1.2 million Write cycles at 85 °C  
More than 200-years data retention  
December 2014  
DocID026468 Rev 2  
1/35  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
 

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