品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 可编程只读存储器电动程控只读存储器电可擦编程只读存储器 | |
页数 | 文件大小 | 规格书 |
39页 | 506K | |
描述 | ||
8 Kbit串行I2C总线EEPROM |
是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | HVSON, SOLCC8,.11,20 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 1.39 | 最大时钟频率 (fCLK): | 0.4 MHz |
数据保留时间-最小值: | 40 | 耐久性: | 1000000 Write/Erase Cycles |
I2C控制字节: | 1010DMMR | JESD-30 代码: | R-PDSO-N8 |
JESD-609代码: | e4 | 长度: | 3 mm |
内存密度: | 8192 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 1024 words | 字数代码: | 1000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 1KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装等效代码: | SOLCC8,.11,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.6 mm |
串行总线类型: | I2C | 最大待机电流: | 0.000001 A |
子类别: | EEPROMs | 最大压摆率: | 0.0008 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2 mm |
最长写入周期时间 (tWC): | 5 ms | 写保护: | HARDWARE |
Base Number Matches: | 1 |
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