5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| M1P-L67201L-55/883 | TEMIC |
获取价格 |
FIFO, 512X9, 55ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67201L-60/883 | TEMIC |
获取价格 |
FIFO, 512X9, 60ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67201L-65/883 | TEMIC |
获取价格 |
FIFO, 512X9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67201V-55/883 | TEMIC |
获取价格 |
FIFO, 512X9, 55ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67201V-60/883 | TEMIC |
获取价格 |
FIFO, 512X9, 60ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67201V-65/883 | TEMIC |
获取价格 |
FIFO, 512X9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67202L-55/883 | TEMIC |
获取价格 |
FIFO, 1KX9, 55ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67202L-60/883 | TEMIC |
获取价格 |
FIFO, 1KX9, 60ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67202L-65/883 | TEMIC |
获取价格 |
FIFO, 1KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
| M1P-L67202V-55/883 | TEMIC |
获取价格 |
FIFO, 1KX9, 55ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
