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M1A3PE3000L-FGG484M PDF预览

M1A3PE3000L-FGG484M

更新时间: 2024-09-20 14:43:15
品牌 Logo 应用领域
ACTEL 时钟可编程逻辑
页数 文件大小 规格书
182页 5610K
描述
Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 250MHz, 75264-Cell, CMOS, PBGA484, 1 MM PITCH, GREEN, FBGA-484

M1A3PE3000L-FGG484M 技术参数

是否Rohs认证:符合生命周期:Transferred
包装说明:1 MM PITCH, GREEN, FBGA-484Reach Compliance Code:compliant
风险等级:5.76Is Samacsys:N
最大时钟频率:250 MHzJESD-30 代码:S-PBGA-B484
JESD-609代码:e1长度:23 mm
湿度敏感等级:3可配置逻辑块数量:75264
等效关口数量:3000000输入次数:341
逻辑单元数量:75264输出次数:341
端子数量:484最高工作温度:125 °C
最低工作温度:-55 °C组织:75264 CLBS, 3000000 GATES
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA484,22X22,40封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):250
电源:1.2/1.5,1.2/3.3 V可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified座面最大高度:2.44 mm
子类别:Field Programmable Gate Arrays最大供电电压:1.575 V
最小供电电压:1.14 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:23 mmBase Number Matches:1

M1A3PE3000L-FGG484M 数据手册

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v1.0  
®
Military ProASIC3/EL Low-Power Flash FPGAs  
with Flash*Freeze Technology  
Advanced and Pro (Professional) I/Os††  
Features and Benefits  
• 700 Mbps DDR, LVDS-Capable I/Os  
Military Temperature Tested and Qualified  
• Each Device Tested from –55°C to 125°C  
Firm-Error Immune  
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
• Bank-Selectable I/O Voltages—up to 8 Banks per Chip  
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /  
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and  
• Not Susceptible to Neutron-Induced Configuration Loss  
LVCMOS 2.5 V / 5.0 V Input  
Low Power  
• Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS  
• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL  
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3  
Class I and II (A3PE3000L only)  
• Dramatic Reduction in Dynamic and Static Power  
• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power  
• Low Power Consumption in Flash*Freeze Mode Allows for  
Instantaneous Entry To / Exit From Low-Power Flash*Freeze  
• I/O Registers on Input, Output, and Enable Paths  
• Hot-Swappable and Cold-Sparing I/Os  
• Programmable Output Slew Rate and Drive Strength  
• Programmable Input Delay (A3PE3000L only)  
• Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)  
• Weak Pull-Up/-Down  
• IEEE 1149.1 (JTAG) Boundary Scan Test  
• Pin-Compatible Packages across the Military ProASIC®3EL  
Family  
Clock Conditioning Circuit (CCC) and PLL  
• Six CCC Blocks, One with Integrated PLL (ProASIC3) and All  
with Integrated PLL (ProASIC3EL)  
ƒ
Mode  
• Supports Single-Voltage System Operation  
HighLowCa-Imppaecditaynce Switches  
• 600 k to 3 M System Gates  
• Up to 504 kbits of True Dual-Port SRAM  
• Up to 620 User I/Os  
Reprogrammable Flash Technology  
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process  
• Live-at-Power-Up (LAPU) Level 0 Support  
• Single-Chip Solution  
HighRePtaeinrsfoPrromgraamncmeed Design when Powered Off  
• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System  
Performance  
• Configurable  
Phase  
Shift, Multiply/Divide,  
Delay  
Capabilities, and External Feedback  
• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V  
systems) and 350 MHz (1.5 V systems)  
• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit  
SRAMs and FIFOs  
PCI (1.2 V systems)  
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,  
and ×18 organizations available)  
In-System Programming (ISP) and Security  
• Secure ISP Using On-Chip 128-Bit Advanced Encryption  
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)  
• True Dual-Port SRAM (except ×18)  
• 24 SRAM and FIFO Configurations with Synchronous  
Operation:  
®
to Secure FPGA Contents  
HighFla-PsheLrofcokrmance Routing Hierarchy  
• Segmented, Hierarchical Routing and Clock Structure  
• High-Performance, Low-Skew Global Network  
• Architecture Supports Ultra-High Utilization  
– 250 MHz: For 1.2 V Systems  
– 350 MHz: For 1.5 V Systems  
ARM® Processor Support in ProASIC3/EL FPGAs  
• ARM Cortex™-M1 Soft Processor Available with or without  
Debug  
Table I-1 • Military ProASIC3/EL Low-Power Devices  
ProASIC3/EL Devices  
ARM Cortex-M1 Devices  
System Gates  
A3PE600L  
A3P1000  
A3PE3000L  
1
M1A3P1000  
M1A3PE3000L  
600 k  
13,824  
108  
24  
1 M  
24,576  
144  
32  
3 M  
75,264  
504  
112  
1 k  
VersaTiles (D-flip-flops)  
RAM kbits (1,024 bits)  
4,608-Bit Blocks  
FlashROM Bits  
1 k  
1 k  
Yes  
1
2
Yes  
6
Yes  
6
Secure (AES) ISP  
Integrated PLL in CCCs  
VersaNet Globals  
I/O Banks  
18  
18  
18  
8
4
8
Maximum User I/Os  
Package Pins  
270  
154  
620  
PQFP  
FBGA  
PQ208  
FG144  
FG484  
FG484, FG896  
Notes:  
1. Refer to the Cortex-M1 product brief for more information.  
2. AES is not available for ARM-enabled ProASIC3/EL devices.  
ƒ
A3P1000 only supports 1.5 V core operation.  
Flash*Freeze technology is not available for A3P1000.  
†† Pro I/Os are not available on A3P1000.  
August 2008  
I
© 2009 Actel Corporation  

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