Datasheet > M14C04

M14C04

更新时间： 2024-11-08 22:30:47

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意法半导体 - STMICROELECTRONICS		/
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Memory Micromodules General Information for D1, D2 and C Packaging

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M14C04 数据手册

D10, D15, D20, D22, C20, C30

MICROMODULES

Memory Micromodules

General Information for D1, D2 and C Packaging

■ Micromodules were developed specifically for

potting side

contact side

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

D15

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

D10

D20

DESCRIPTION

Memory Cards consist of two main parts: the

plastic card, and the embedded Micromodule

(which, in turn, carries the silicon chip).

D22

The plastic card is made of PVC, ABS or similar

material, and can be over-printed with graphics,

text, and magnetic strips. The Micromodule is

embedded in a cavity in the plastic card.

The Micromodules are mounted on Super 35 mm

metallized epoxy tape, and are delivered on reels.

These contain all of the chips from a number of

wafers, including those chips that were found to be

non-functioning during testing. Traceability is

ensured by a label fixed on the reel.

C30

C20

Table 1. Memory Card and Memory Tag Integrated Circuits

Please see the data briefing sheets of these products for example illustrations of these

micromodules

Module

D10

D15

D20

D22

C30

C20

ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355

ST14C02, ST1305B, ST1335, ST1336, ST1355

ST14C02, M14C04, M14C16, M14C32

M14C64, M14128, M14256

M35101, M35102

December 1999

1/13

12 3 4 5 6 7...13

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