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M11L416256SA-28T PDF预览

M11L416256SA-28T

更新时间: 2024-02-22 14:32:02
品牌 Logo 应用领域
晶豪 - ESMT 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
16页 230K
描述
EDO DRAM, 256KX16, 28ns, CMOS, PDSO40, TSOP2-44/40

M11L416256SA-28T 技术参数

生命周期:Obsolete包装说明:TSOP2, TSOP40/44,.46,32
Reach Compliance Code:unknown风险等级:5.84
访问模式:EDO PAGE最长访问时间:28 ns
其他特性:SELF REFRESHI/O 类型:COMMON
JESD-30 代码:R-PDSO-G40长度:18.41 mm
内存密度:4194304 bit内存集成电路类型:EDO DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:40
字数:262144 words字数代码:256000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:256KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP40/44,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
电源:3.3 V认证状态:Not Qualified
刷新周期:512座面最大高度:1.2 mm
自我刷新:YES最大待机电流:0.002 A
子类别:DRAMs最大压摆率:0.19 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

M11L416256SA-28T 数据手册

 浏览型号M11L416256SA-28T的Datasheet PDF文件第2页浏览型号M11L416256SA-28T的Datasheet PDF文件第3页浏览型号M11L416256SA-28T的Datasheet PDF文件第4页浏览型号M11L416256SA-28T的Datasheet PDF文件第6页浏览型号M11L416256SA-28T的Datasheet PDF文件第7页浏览型号M11L416256SA-28T的Datasheet PDF文件第8页 
M11L416256A/M11L416256SA  
(Continued)  
-25  
-28  
-30  
-35  
-40  
PARAMETER  
SYMBOL  
UNIT NOTES  
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX  
RCH  
RRH  
ns  
t
t
0
0
3
0
0
3
Read Command Hold Time Reference to  
Read Command Hold Time Reference to  
0
0
3
0
0
3
0
0
3
9,15,19  
CAS  
RAS  
ns  
ns  
9
CLZ  
20  
t
to Output in Low-Z  
CAS  
Output Buffer Turn-off Delay From  
RAS  
or  
CAS  
OFF1  
3
15  
6
3
15  
7
ns  
ns  
t
3
15  
8
3
15  
8
3
15  
8
10,17,20  
17,26  
OFF2  
t
t
t
t
Output Buffer Turn-off to  
OE  
Write Command Setup Time  
Write Command Hold Time  
WCS  
WCH  
WCR  
WP  
ns  
ns  
ns  
ns  
11,15,18  
15,25  
15  
0
5
0
5
0
5
0
5
0
5
22  
24  
Write Command Hold Time(Reference to  
Write Command Pulse Width  
)
26  
30  
34  
RAS  
15  
t
5
7
5
7
5
8
6
5
9
7
5
10  
8
RWL  
ns  
15  
t
t
Write Command to  
Lead Time  
Lead Time  
RAS  
CAS  
CWL  
ns  
ns  
ns  
15,19  
12,20  
12,20  
5
0
5
0
Write Command to  
Data-in Setup Time  
Data-in Hold Time  
DS  
DH  
t
0
5
0
5
0
5
t
5
5
DHR  
ns  
ns  
ns  
ns  
t
22  
24  
Data-in Hold Time (Reference to  
)
26  
30  
34  
RAS  
RWD  
34  
21  
17  
38  
25  
19  
11  
11  
t
t
t
to  
Delay Time  
WE  
46  
31  
25  
51  
34  
26  
56  
36  
27  
RAS  
AWD  
CWD  
Column Address to  
Delay Time  
WE  
11,18  
2,3  
to  
Delay Time  
WE  
CAS  
Transition Time (rise or fall)  
Refresh Period (512 cycles)  
T
ns  
ms  
ms  
t
1.5 50 1.5 50  
1.5 50 2.5 50 2.5 50  
REF  
REF  
t
8
8
8
8
8
Refresh Period (512 cycles) Self Refresh  
t
32  
32  
32  
32  
32  
RPC  
CSR  
CHR  
ns  
ns  
ns  
t
t
t
10  
5
10  
5
to  
Precharge Time  
CAS  
10  
10  
10  
10  
10  
10  
10  
10  
10  
RAS  
CAS  
CAS  
1,18  
1,19  
Setup Time(CBR REFRESH)  
Hold Time(CBR REFRESH)  
7
7
Hold Time From  
Write Cycle  
During Read-Mode-  
WE  
High Setup Time  
CAS  
OE  
OEH  
OES  
ns  
16  
t
t
4
4
4
4
5
ns  
ns  
ns  
4
2
2
4
2
2
Low to  
4
2
2
4
2
2
5
2
2
OE  
OE  
OE  
OE  
OEHC  
t
High Hold Time From  
Precharge Time  
High  
CAS  
OEP  
t
Setup Prior to  
During Hidden Refresh  
RAS  
ORD  
ns  
ns  
t
0
4
0
5
0
5
0
5
0
6
Cycle  
Last  
High  
Going Low to First  
Returning  
CAS  
CAS  
CLCH  
21  
t
COH  
ns  
ns  
t
3
3
3
3
Data Output Hold After  
Returning Low  
3
3
3
3
3
3
CAS  
WHZ  
t
7
7
7
7
7
Output Disable Delay From  
WE  
µ s  
RASS  
RPS  
27,28  
27,28  
27,28  
t
100  
43  
-50  
5
Self Refresh  
Self Refresh  
Self Refresh  
Low Pulse width  
High Precharge Time  
Hold Time  
100  
55  
-50  
100  
65  
-50  
100  
75  
-50  
RAS  
RAS  
CAS  
ns  
ns  
t
5
CHS  
t
-50  
Elite Memory Technology Inc  
Publication Date: Agu. 2001  
Revision : 1.3 5/16  

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