Datasheet > M1007S157 26.000000

M1007S157 26.000000

更新时间： 2024-11-21 14:54:11

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MTRONPTI		/
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3页	402K
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M1007S157 LOW‐PROFILE SMT CRYSTAL

FEATURES

• 100% electrical test over –40°C to +85°C and at +25°C

• CoC and Packing Slip to be included with each shipment

• Domestic USA build only

• Hermetically Sealed 5x7mm Ceramic Package

• SnPb solder tinned pads

ELECTRICAL SPECIFICATIONS

Parameter

Mode of Oscillation

Frequency

Symbol

Min.

Typ.

Max.

Units

Conditions

Fundamental (AT‐Cut)

26.000000

Applications

F^O

F/F

MHz

ppm

Frequency Tolerance

‐30

‐50

‐5

+30

+50

@ +25°C

Test and Measurement

Communications Equipment

Microprocessor Timing

Public Safety

Over Operating

Temperature

1st year

Frequency Stability

F/F

ppm

Aging

ppm

Load Capacitance

Shunt Capacitance

ESR

C^L

3.0

5.0

Drive Level

D^L

T^S

500

‐40

‐55

100

µW

MΩ

°C

Insulation Resistance

Operating Temperature

Storage Temperature

+85

+125

°C

ENVIRONMENTAL CHARACTERISTICS

Quality &

Mechanical Shock

Vibration

Thermal Cycle

Per MIL‐STD‐883, M2002, Condition C 3,000 g’s

Per MIL‐STD‐STD‐202, M204, Condition D , 20 g’s

Certifications

Per MIL‐STD‐883, M1010, B (‐55°C to 125°C, 15 min. dwell, 10 cycles)

Per MIL‐STD‐202, M112 (1 x 10^‐8atm cc/s of Helium)

Per MIL‐STD‐202, M112 (30 second immersion)

Per MILSTD‐883, M2001, Condition A, 5,000 g’s Y1

Per MILSTD‐883, M1009, Condition A

AS9100 Rev D

Fine Leak Test

Gross Leak Test

Constant Acceleration

Salt Atmosphere

Internal Water Vapor

Solderability

ISO9001:2008

Per MILSTD‐883, M1018, 5,000ppm Max

Per EIAJ‐STD‐002

Max. Soldering Conditions

Package Type

See solder profile, Figure 1

5.0 x 7.0 x 1.2 mm, 4‐pad LLCC. Sn‐Pb tinned pads.

SOLDERING CONDITIONS

Figure 1

http://www.mtronpti.com

407-298-2000 MtronPTI 2525 Shader Road Orlando, FL

32804

12 3

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