M1007S161 LOW‐PROFILE SMT CRYSTAL
FEATURES
• 100% electrical test over –40°C to +85°C and at +25°C
• CoC and Packing Slip to be included with each shipment
• Domestic USA build only
• Hermetically Sealed 5x7mm Ceramic Package
• SnPb solder tinned pads
ELECTRICAL SPECIFICATIONS
Parameter
Mode of Oscillation
Frequency
Symbol
Min.
Typ.
Max.
Units
Conditions
Fundamental (AT‐Cut)
10.000000
Applications
FO
F/F
MHz
ppm
Test and Measurement
Communications Equipment
Microprocessor Timing
Public Safety
Frequency Tolerance
‐20
‐50
‐5
+20
+50
+5
@ +25°C
Over Operating
Temperature
1st year
Frequency Stability
F/F
ppm
Aging
ppm
pF
pF
Load Capacitance
Shunt Capacitance
ESR
CL
CO
18
7.0
70
Ω
Drive Level
DL
IR
TA
TS
10
500
‐40
‐55
100
500
µW
MΩ
°C
Insulation Resistance
Operating Temperature
Storage Temperature
+85
+125
°C
ENVIRONMENTAL CHARACTERISTICS
Quality &
Mechanical Shock
Vibration
Thermal Cycle
Per MIL‐STD‐883, M2002, Condition C 3,000 g’s
Per MIL‐STD‐STD‐202, M204, Condition D , 20 g’s
Per MIL‐STD‐883, M1010, B (‐55°C to 125°C, 15 min. dwell, 10 cycles)
Per MIL‐STD‐202, M112 (1 x 10‐8 atm cc/s of Helium)
Per MIL‐STD‐202, M112 (30 second immersion)
Per MILSTD‐883, M2001, Condition A, 5,000 g’s Y1
Per MILSTD‐883, M1009, Condition A
Certifications
AS9100 Rev D
Fine Leak Test
Gross Leak Test
Constant Acceleration
Salt Atmosphere
Internal Water Vapor
Solderability
ISO9001:2008
Per MILSTD‐883, M1018, 5,000ppm Max
Per EIAJ‐STD‐002
Max. Soldering Conditions See solder profile, Figure 1
Package Type
5.0 x 7.0 x 1.2 mm, 4‐pad LLCC. Sn‐Pb tinned pads.
SOLDERING CONDITIONS
Figure 1
http://www.mtronpti.com
407-298-2000 MtronPTI 2525 Shader Road Orlando, FL
32804