LX3044 / 45 / 46
10.3 Gbps Coplanar GaAs PIN Photo Diode
I N T E G R A T E D P R O D U C T S
PRODUCTION DATA SHEET
KEY FEATURES
DESCRIPTION
ꢀ LX3044 Single Die
ꢀ LX3045, 1x4 Array Die
ꢀ LX3046, 1x12 Array Die
ꢀ Coplanar Waveguide , 50ohm
ꢀ High Responsivity
Microsemi’s GaAs Coplanar PIN
Photo Diode chips are ideal for high are currently offered in die form
bandwidth 850nm optical networking allowing manufacturers the versatility
applications.
The device family offers superior wire or flip chip configurations.
noise performance and sensitivity in This device is ideal
single die, 1x4 array die or 1x12 array manufacturers of optical receivers,
die. transponders, optical transmission
The LX304X family of photo diodes
of custom assembly using either bond
ꢀ Low Dark Current
for
ꢀ High Bandwidth
ꢀ Anode/Cathode on Illuminated
Side
modules and combination PIN photo
diode – transimpedance amplifier.
ꢀ 125mm Pad pitch
ꢀ Die Good for Bond Wire or Flip
Chip Applications
APPLICATIONS
ꢀ Short Reach Optical Networks
ꢀ 10Gigabit Ethernet, Fibre
Channel
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
ꢀ VCSEL Array Receiver
BENEFITS
ꢀ Large Wirebond Contact Pads
ꢀ Low Contact Resistance
PRODUCT HIGHLIGHT
ꢀ Coplanar Design (gnd-signal-gnd) 50 ohm
characteristic impedance
ꢀ 125 um standard pad pitch for ease of test
ꢀ Large 75um x 75um pad size for ease of
packaging
ꢀ Wire bond or Flip Chip capability
Single Die
1x4 Die
1x12 Die
PACKAGE ORDER INFO
Die Dimension1 Pad Dimension1
Active Area, A
Pad Pitch, p1 Die Thickness1
(µm)
(µm)
Die
TJ (°C)
Die
(µm)
(µm)
(µm)
Y
450
X
450
w
v
LX3044
LX3045
LX3046
75
75
75
75
75
75
125
125
125
152
203
203
0 to 70
75
450 1200
450 3200
1. See Package Dimensions (page 4)
Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. LX3044T)
Copyright 2000
Microsemi
Integrated Products Division
Page 1
Rev. 1.0, 2002-10-29
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570