是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | DFN | 包装说明: | HVSON, |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.02 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-PDSO-N8 | JESD-609代码: | e3 |
长度: | 3 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.8 mm |
最大供电电压 (Vsup): | 5.25 V | 最小供电电压 (Vsup): | 2.8 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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