是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | LGA-12 | Reach Compliance Code: | compliant |
Factory Lead Time: | 12 weeks | 风险等级: | 5.59 |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-PBGA-B12 |
长度: | 2 mm | 功能数量: | 1 |
端子数量: | 12 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFLGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 1.71 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | BUTT | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 2 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LSM303AGRTR | STMICROELECTRONICS |
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e-Compass with 3D digital linear acceleration sensor, 3D digital magnetic sensor | |
LSM303AH | STMICROELECTRONICS |
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电子罗盘:3D数字加速度计,3D数字磁力计 | |
LSM303AHTR | STMICROELECTRONICS |
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e-Compass: 3D digital accelerometer, 3D digital magnetometer | |
LSM303CTR | STMICROELECTRONICS |
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Ultra-compact high-performance e-compass 3D accelerometer and 3D magnetometer module | |
LSM303D | STMICROELECTRONICS |
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Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module | |
LSM303DLH | STMICROELECTRONICS |
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Sensor module: 3-axis accelerometer and 3-axis magnetometer | |
LSM303DLHC | STMICROELECTRONICS |
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Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module | |
LSM303DLHCTR | STMICROELECTRONICS |
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Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module | |
LSM303DLHTR | STMICROELECTRONICS |
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Sensor module: 3-axis accelerometer and 3-axis magnetometer | |
LSM303DLM | STMICROELECTRONICS |
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Sensor module:3-axis accelerometer and 3-axis magnetometer |