品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | / | |
页数 | 文件大小 | 规格书 |
52页 | 1228K | |
描述 | ||
Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | LGA | 包装说明: | VFLGA, LCC16,.12SQ,20 |
针数: | 16 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 8.59 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-PBGA-BU16 | 长度: | 3 mm |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFLGA |
封装等效代码: | LCC16,.12SQ,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.16 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | BUTT | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
LSM303DTR | STMICROELECTRONICS |
完全替代 |
e-Compass: 3D accelerometer, 3D magnetometer, ultra compact, high performance, I2C, SPI in | |
LSM303DLM | STMICROELECTRONICS |
类似代替 |
Sensor module:3-axis accelerometer and 3-axis magnetometer | |
LSM303DLMTR | STMICROELECTRONICS |
功能相似 |
Sensor module:3-axis accelerometer and 3-axis magnetometer |
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Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module | |
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