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LSE2040 PDF预览

LSE2040

更新时间: 2024-10-28 11:43:55
品牌 Logo 应用领域
立碁电子 - LIGITEK /
页数 文件大小 规格书
5页 102K
描述
ROUND TYPE LED LAMPS

LSE2040 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
风险等级:5.78Base Number Matches:1

LSE2040 数据手册

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LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
PART NO. LSE2040  
4/4  
Reliability Test:  
Reference  
Description  
Test Item  
Test Condition  
Standard  
1.Under Room Temperature  
2.If=20mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resisance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under ondition  
of hogh temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hous.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105±5&-40±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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