Datasheet > LQM18NNR10K00#

LQM18NNR10K00#

更新时间： 2024-11-08 11:11:03

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村田 - MURATA		/
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数据手册

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LQM18NNR10K00# 数据手册

Reference Only

Spec No. JELF243B-0003S-01

Soldering profile

P.6/10

(1) Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

150℃, 60s min.

Limit Profile

Pre-heating

Heating

Cycle of flow

250℃, 4s～6s

2 times

265℃±3℃, 5s

2 times

(2) Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C, 90s±30s

Heating

Peak temperature

Cycle of reflow

above 220°C, 30s～60s

above 230°C, 60s max.

260°C, 10s

245°C±3°C

2 times

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C, 1 min

350°C max.

80W max.

φ3mm max.

3(+1, -0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Time

2 times

Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the products due to the thermal shock.

11.5 Solder Volume

・ Solder shall be used not to be exceed the upper limits as shown below.

・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

T： thickness of product

MURATA MFG.CO., LTD

1...3 4 567 8 9

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