是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FBGA, BGA237,16X16,40 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 2.12 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-PBGA-B237 | 长度: | 17 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 237 | 最高工作温度: | 85 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | FBGA | 封装等效代码: | BGA237,16X16,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 1.7 mm |
最大供电电压 (Vsup): | 3.465 V | 最小供电电压 (Vsup): | 2.8 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 17 mm |
Base Number Matches: | 1 |
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