是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | QFP |
包装说明: | LFQFP, QFP144,.87SQ,20 | 针数: | 144 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.32 | Is Samacsys: | N |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 32 | CPU系列: | ARM7 |
最大时钟频率: | 25 MHz | DAC 通道: | YES |
DMA 通道: | YES | 外部数据总线宽度: | |
JESD-30 代码: | S-PQFP-G144 | JESD-609代码: | e3 |
长度: | 20 mm | 湿度敏感等级: | 2 |
I/O 线路数量: | 104 | 端子数量: | 144 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFQFP | 封装等效代码: | QFP144,.87SQ,20 |
封装形状: | SQUARE | 封装形式: | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
认证状态: | Not Qualified | RAM(字节): | 100352 |
ROM(单词): | 524288 | ROM可编程性: | FLASH |
座面最大高度: | 1.6 mm | 速度: | 72 MHz |
子类别: | Microcontrollers | 最大压摆率: | 100 mA |
最大供电电压: | 3.6 V | 最小供电电压: | 3 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 20 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
LPC2388FBD144,551 | NXP |
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