LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
Vcc
-0.3
-0.3
-0.3
MAX
5.5
UNIT
V
Vcp
Supply Voltage for Charge Pump
Charge Pump Output Pin
All Vcc Pins
CPout
Vcc
Vcp
V
3.6
V
Others
TSolder
TJunction
All Other I/O Pins
Vcc + 0.3
260
V
Lead Temperature (solder 4 seconds)
Junction Temperature
°C
°C
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
150
3
UNIT
°C
TSTG
MSL
Storage Temperature Range
-65
Moisture Sensitivity Level
n/a
V
Human body model (HBM) ESD stress voltage(2)
Charged device model (CDM) ESD stress voltage(3)
2500
1500
(1)
VESD
V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
SYMBOL
Vcc
PARAMETER
PLL Supply Voltage
DEVICE
MIN
3.15
Vcc
-40
TYP
MAX
3.45
5.25
85
UNIT
V
3.3
Vcp
Charge Pump Supply Voltage
V
LMX2492
LMX2492-Q1
LMX2492
TA
TJ
Ambient Temperature
°C
°C
-40
125
125
135
-40
Junction Temperature
LMX2492-Q1
-40
7.4 Thermal Information
THERMAL METRIC(1)
Temperature
UNIT
RθJA
RθJC
ψJB
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-board characterization parameter
39.4
7.1
20
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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