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LMV221SDX/NOPB PDF预览

LMV221SDX/NOPB

更新时间: 2023-09-03 20:26:25
品牌 Logo 应用领域
德州仪器 - TI 光电二极管
页数 文件大小 规格书
48页 2490K
描述
用于 CDMA 和 WCDMA 的 50MHz 至 3.5GHz 40dB 对数功率检测器 | NGF | 6 | -40 to 85

LMV221SDX/NOPB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SON
包装说明:HVSON,针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:5.06模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-N6JESD-609代码:e3
长度:2.5 mm湿度敏感等级:1
功能数量:1端子数量:6
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVSON
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260座面最大高度:0.8 mm
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:2.2 mm
Base Number Matches:1

LMV221SDX/NOPB 数据手册

 浏览型号LMV221SDX/NOPB的Datasheet PDF文件第1页浏览型号LMV221SDX/NOPB的Datasheet PDF文件第2页浏览型号LMV221SDX/NOPB的Datasheet PDF文件第3页浏览型号LMV221SDX/NOPB的Datasheet PDF文件第5页浏览型号LMV221SDX/NOPB的Datasheet PDF文件第6页浏览型号LMV221SDX/NOPB的Datasheet PDF文件第7页 
LMV221  
SNWS018D DECEMBER 2006REVISED JUNE 2016  
www.ti.com  
6 Specifications  
6.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
MAX  
UNIT  
SUPPLY VOLTAGE  
VDD - GND  
3.6  
V
RF INPUT  
Input power  
10  
dBm  
mV  
DC voltage  
400  
Enable input voltage  
Junction temperature(2)  
Maximum lead temperature (soldering, 10 seconds)  
Storage temperature, Tstg  
VSS – 0.4 V < VEN < VDD + 0.4 V  
150  
260  
°C  
°C  
°C  
–65  
150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The maximum power dissipation is a function of TJ(MAX) , RθJA. The maximum allowable power dissipation at any ambient temperature is  
PD = (TJ(MAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board.  
6.2 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±2000  
Charged-device model (CDM), per JEDEC specification JESD22-  
C101(2)  
V(ESD)  
Electrostatic discharge  
±2000  
±200  
V
Machine model  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
2.7  
NOM  
MAX  
3.3  
UNIT  
V
Supply voltage  
Ambient temperature  
RF frequency  
–40  
50  
85  
°C  
3500  
–5  
MHz  
dBm  
dBV  
–45  
–58  
RF input power(1)  
–18  
(1) Power in dBV = dBm + 13 when the impedance is 50 Ω.  
6.4 Thermal Information  
LVM221  
THERMAL METRIC(1)  
NGF (WSON)  
UNIT  
6 PINS  
100.4  
120  
RθJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
7
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
69.6  
6.9  
ψJB  
RθJC(bot)  
69.9  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics, SPRA953.  
(2) The maximum power dissipation is a function of TJ(MAX) , RθJA. The maximum allowable power dissipation at any ambient temperature is  
PD = (TJ(MAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board.  
4
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Product Folder Links: LMV221  
 

LMV221SDX/NOPB 替代型号

型号 品牌 替代类型 描述 数据表
LMV221SD/NOPB TI

完全替代

用于 CDMA 和 WCDMA 的 50MHz 至 3.5GHz 40dB 对数功率检测器

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采用微型 SMD 封装且适用于 CDMA 和 WCDMA 的射频功率检测器 | NGF |